The invention provides an
ion cleaning magnetron
sputtering system. The
ion cleaning magnetron
sputtering system comprises a vacuum cavity, a target material substrate and a
wafer tray, wherein the target material substrate and the
wafer tray are arranged in the vacuum cavity, the target material substrate and the
wafer tray are connected with a negative
electrode of a power supply or the ground,target materials are arranged on the target material substrate, a wafer is arranged on the wafer tray, and the vacuum cavity is provided with a gas inlet and an exhaust
system; the
ion cleaning magnetron
sputtering system further comprises a
shutter device and switching devices, wherein the
shutter device is provided with a
shutter cover capable of covering or exposing the target materials, one ofthe two switching devices is arranged in a power supply circuit of the wafer tray, and the other one of the switching devices is arranged in a power supply circuit of the target material substrate and the shutter device. The two processes of
plasma cleaning and magnetron sputtering are performed through the same set of devices through the switching devices (
power switching systems), the purpose of simultaneously achieving wafer ion cleaning and magnetron sputtering is achieved through a shutter device and the two functional switching devices, the
coating process is conveniently and reliably completed through the control of the program, and equipment is saved.