A thermoelectric module which includes a case 1, a heat-
radiation side insulating substrate 4a, a heat-absorption side insulating substrate 4b, a first
soldering layer 5a formed of a first
soldering agent to connect the heat-
radiation side insulating substrate 4a and the case 1, a plurality of P-type and N-type
semiconductor chips interposed between the heat-
radiation side insulating substrate 4a and the heat-absorption side insulating substrate 4b, the plurality of P-type and N-type
semiconductor chips being arranged alternately, and a second
soldering layer 15a (15b) formed of a second soldering agent to connect the heat-radiation side insulating substrate 4a and one end of each of the plural P-type and N-type
semiconductor chips (the heat-absorption side insulating substrate 4b and the other end of each of the plural P-type and N-type semiconductor chips), the first soldering agent and the second soldering agent being identical in
raw material.