The invention relates to the technical field of circuit boards, and particularly relates to an automobile circuit board heat dissipation device. The heat dissipation device comprises a liquid coolingplate, a heat dissipation groove, a loop
pipe frame, a
branch pipe, a heat conduction seat, a heat conduction
adhesive layer, a circuit board protection shell, an input
pipe, a return pipe, a heat dissipation
assembly and a protection shell, wherein the heat dissipation groove is formed in the liquid cooling plate; the loop pipe frame is located in the heat dissipation groove; the
branch pipe is fixedly installed on the loop pipe frame; the
branch pipe is communicated with the loop pipe frame; the heat conduction seat is fixedly connected with the top of the liquid cooling plate; the bottom ofthe heat conduction seat is fixedly connected with the heat conduction
adhesive layer through a heat conduction
adhesive; the circuit board protection shell is fixedly installed on the top of the heat conduction seat; and the circuit board is placed and installed in the circuit board protection shell. The purpose of rapid heat dissipation of the circuit board is achieved,
impact resistance protection of the circuit board can be achieved, the heat dissipation efficiency is improved, and meanwhile, the size of the heat dissipation
assembly is reduced.