The invention relates to composition, a preparation method and application of a solid cleaning adhesive. The solid cleaning adhesive comprises a hard monomer, a soft monomer, an organic solvent, an initiator, other functional aids and the like, and is prepared through polymerization and a series of posttreatment. The prepared solid cleaning adhesive is a solid cleaning product with certain adhesion, remove solid microparticles, dust and metallic pollution on surfaces and in gaps of chips and devices through the adhesion and high deformability of the surface of the material, ensures no residue or secondary pollution, cannot scratch or damage the chips and the devices, is harmless to a human body, and can be widely applied to semiconductors, microelectronic devices, printed circuit boards, television picture tubes, precision instruments, liquid crystal displays, computer keyboards, equipment in automobiles, mobile phones, audio / video equipment and the like.