The invention discloses a quantum dot LED packaging device and a manufacturing method thereof. The device mainly comprises a quantum dot material or a mixture of quantum dots and fluorescent powder which is positioned between two layers of glass, or is protected by at least upper-layer glass, epoxy resin or other protective materials which are coated on the peripheral edge between the pieces of glass, an inverted LED chip which is bonded on the lower surface of the glass layer, a film layer and water glue coated at the periphery of the inverted LED chip, wherein the water glue is used for sealing the quantum dot material into a closed cavity formed by an upper layer of glass, a lower layer of glass, epoxy resin or other protective materials, and after the lower surface of the glass is bonded to the upper surface of the flip LED chip, the periphery of the whole structure is coated with the white glue. On the basis of ensuring the light emitting uniformity, the use amount of the quantumdot material is reduced, and water and oxygen isolation sealing is realized, so that the material failure is reduced, the device stability is improved, in addition, the chip light emitting utilizationrate is improved, the light effect, the power bearing capability, the device adaptability and the service life are improved, and the cost is reduced.