Quantum dot LED packaging device and manufacturing method thereof

Abstract

The invention discloses a quantum dot LED packaging device and a manufacturing method thereof. The device mainly comprises a quantum dot material or a mixture of quantum dots and fluorescent powder which is positioned between two layers of glass, or is protected by at least upper-layer glass, epoxy resin or other protective materials which are coated on the peripheral edge between the pieces of glass, an inverted LED chip which is bonded on the lower surface of the glass layer, a film layer and water glue coated at the periphery of the inverted LED chip, wherein the water glue is used for sealing the quantum dot material into a closed cavity formed by an upper layer of glass, a lower layer of glass, epoxy resin or other protective materials, and after the lower surface of the glass is bonded to the upper surface of the flip LED chip, the periphery of the whole structure is coated with the white glue. On the basis of ensuring the light emitting uniformity, the use amount of the quantumdot material is reduced, and water and oxygen isolation sealing is realized, so that the material failure is reduced, the device stability is improved, in addition, the chip light emitting utilizationrate is improved, the light effect, the power bearing capability, the device adaptability and the service life are improved, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor lighting, in particular to a quantum dot LED packaging device and a manufacturing method. Background technique [0002] With the improvement of economic level, people's pursuit of high-quality life is becoming more and more urgent. The improvement of light source and display effect will make people feel more comfortable and comfortable. As a new type of luminescent material, quantum dot materials have a wide laser spectrum. , good monochromaticity, adjustable luminous wind wavelength, high conversion efficiency, can achieve precise control of the spectrum and effective improvement of the color gamut of backlight products, and has more economic advantages and application prospects compared with the current phosphor solution. [0003] However, the existing quantum dot materials have poor water and oxygen stability, short life and rapid failure under conventional packaging, and ordinary packagi...

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Problems solved by technology

[0003] However, the existing quantum dot materials have poor water and oxygen stability, short life and rapid failure under conventional packaging, and ordinary packaging methods cannot achieve effective protection of materials. The existing quantum dot applications only stay at the diaphragm stage, and the amount of materials used is large. , poor device adaptability, and low yield and yield

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