A solder resist ink circuit board manufacture method includes providing a substrate, paving a screen on the copper foil of the substrate, painting ink on the screen, removing the screen, fitting a protecting film on the substrate, pressing rapidly in vacuum, cooling, removing the protecting film, performing copper etch, removing the copper foil except for the ink layer and removing the ink on the surface of the copper foil. According to the method, after the screen printing is adopted, the protecting film is fitted to the surface of the solder resist ink, the ink is pressed in the manner of vacuum rapid pressing, the thickness of the ink is even and is controlled, the thickness of the ink can be adjusted according to production requirements, the adaptability is high, the automation level is high, and the product qualification rate is guaranteed.