30results about How to "Good vacuum tightness" patented technology

The invention discloses a lead-free solder for quartz glass sealing. The matrix of the lead-free solder is tin, and the atomic percentage components of Ti and O introduced are Ti: 0.2% to 6%, O: 0.05% to 5.9%, wherein the atomic ratio of Ti and O is greater than 1, and the lead-free solder The mass percentage of impurities in is less than or equal to 0.1%. The soldering temperature range of the lead-free solder is 600℃~800℃, and the welding vacuum degree is less than or equal to 5×10 ‑3 Pa. The lead-free solder for quartz glass sealing of the present invention does not need flux during the sealing process of quartz glass, simplifies the sealing process of quartz glass, and improves the vacuum sealing reliability of quartz glass sealing. The lead-free solder can be widely used in quartz glass sealing, and can also be used in quartz glass, the softening temperature of which is not lower than 800 ℃ 2 Mutual welding of glass, titanium, and metal with titanium coating on the surface as the main component. It is especially suitable for preparing pulsed xenon lamps, which can significantly improve the service life and working reliability of the pulsed xenon lamps.

The invention discloses a pulse xenon lamp and a sealing method of the same. The pulse xenon lamp and the sealing method of the same are characterized in that two ends in a quartz tube in a xenon lamp are respectively provided with an electrode I and an electrode II along a transverse central axis; the electrode I and the electrode II are bilaterally symmetrical with a longitudinal central axis of the quartz tube; the tail of the electrode I at the right end of the longitudinal central axis of the quartz tube is fixedly connected with an electrode cap, a patchplug and a cable wire along the transverse central axis successively; the structure of the left end of the longitudinal central axis of the quartz tube is the same as the structure of the right end of the longitudinal central axis of the quartz tube; the electrode cap sleeves the outside of the port of the quartz tube, and active solders are filled between the electrode cap and the port of the quartz tube, and are heated to more than 600DEG C in a vacuum environment being less than 5*10-3Pa; and when the active solders are fused and are fully reacted with quartz glass, direct non-coupling sealing of the electrode cap and the quartz tube is completed. The sealing method of the pulse xenon lamp is easy to realize automation and large scale production of xenon lamp sealing, is simple and stable in the sealing process, is high in the vacuum sealing performance of the sealing area, and is high in structural intensity. The xenon lamp can bear large current, and the service life and working reliability of the xenon lamp are significantly improved.

The invention relates to an automatic compensation type vacuum tube connecting device and a dredging machinery with the connecting device. The connecting device is characterized by comprising a dynamic connecting pipe and a static connecting pipe; an annular flange is arranged in a port of a connecting end of the dynamic connecting pipe with the static connecting pipe; a sealing rubber, a concave ring, a spring and a circular pipe guide base coat a connecting end of the static connecting pipe with the dynamic connecting pipe from top to bottom in sequence; the top of the sealing rubber is butted against the annular flange, and the bottom is arranged in the concave ring; and the spring is butted against between the bottom of the concave ring and the top of the circular pipe guide base. The vacuum pipe connecting device consisting of the dynamic connecting pipe and the static connecting pipe can be connected and preferably sealed in the dirt sucking operation, can be released when unloading a sewage tank, and can eliminate errors generated in the manufacturing process and higher pressure stress generated in the joint process of the dynamic connecting pipe and the static connecting pipe.

The invention discloses a Sn-Ti-Cu ternary alloy solder for quartz glass sealing. The matrix of the ternary alloy solder is tin, the weight percent components of Ti and Cu introduced are Ti: 0.1%-2.0%, Cu: 0.1%-1.0%, and the atomic percent components of O introduced are 0.05%-4.9% %, the mass percentage of impurities in the ternary alloy solder is less than or equal to 0.1%. The welding temperature range of the ternary alloy solder is 650℃~800℃, and the welding vacuum degree is less than or equal to 5×10 ‑3 Pa. The ternary alloy solder does not need flux in the quartz glass sealing process, simplifies the quartz glass sealing process, and improves the vacuum sealing reliability of the quartz glass sealing. The ternary alloy solder can be widely used not only in quartz glass sealing, but also in silica glass, which has a softening temperature of not lower than 800 °C and is made of SiO 2 The mutual welding of glass, titanium, oxygen-free copper and metal with titanium coating on the surface as the main component is especially suitable for the preparation of pulsed xenon lamps, which can significantly improve the service life and working reliability of pulsed xenon lamps.

The invention relates to chemical vapor deposition equipment which comprises a shell, a reaction system, and a heating element positioned between the shell and the reaction system, wherein the reaction system is arranged in the shell, and comprises a raw material supply device and a reaction room; the heating element is arranged on the inner wall of the shell on the outer sides of the raw material supply device and the reaction room. The chemical vapor deposition equipment is characterized in that the shell comprises a shell main body and a door; an inner cavity is formed by surrounding of the shell main body and the door, and is a cuboid; the door can be opened or close one surface of the inner cavity. The chemical vapor deposition equipment, provided by the invention, can prepare materials with huge size, and realizes the preparation of the materials with huge size under the premise of possibly decreasing the volume; the single-surface door opening design enables the daily mounting and disassembly of internal components to be directly operated simply on the ground level; the control and use of a reaction furnace can be realized by less manpower; the chemical vapor deposition equipment satisfies the industrial large-scale production of preparing the materials with huge size by the CVD (Chemical Vapor Deposition) technology, improves the productivity, and reduces the production cost.