The invention discloses lead-free solder for sealing
quartz glass. A matrix of the lead-free solder is
tin, and the atomic percent of introduced Ti and O is a follows: 0.2-6% of Ti and 0.05-5.9% of O.The atom ratio of Ti and O is greater than 1, and the
mass percent of impurities in the lead-free solder is smaller than or equal to 0.1%. The
welding temperature range of the lead-free solder is 600-800 DEG C, and the
welding vacuum degree is smaller than or equal to 5*10<-3>Pa. In a
quartz glass sealing process, scaling
powder is not needed for the lead-free solder for sealing
quartz glass, sothat the quartz glass sealing process is simplified and the vacuum sealing reliability of quartz glass sealing is improved. The lead-free solder can be widely applied to quartz glass sealing and can be also applied to
welding quartz glass, glass, the
softening temperature of which is not lower than 800 DEG C, taking SiO2 as a
primary component, a
titanium material, metals with
titanium plating onthe surface and the like. The lead-free solder is in particular suitable for preparing a pulse
xenon lamp, so that the service life of the pulse
xenon lamp can be prolonged obviously and the working reliability of the pulse
xenon lamp can be improved obviously.