53results about How to "Flexible packaging" patented technology

This invention provides a semiconductor flip chip package including a carrier substrate and a flip chip electrically coupled to the carrier substrate by a plurality of interconnections. A first input / output (I / O) terminal of the semiconductor flip chip package and a bond wire electrically couple the first I / O terminal to a first interconnection of the plurality of interconnections at a first surface of the carrier substrate. The semiconductor flip chip package is more flexible and is lower in cost.

The invention discloses a method and a device for processing user requests, and relates to the technical field of computers. A specific implementation of the method includes: receiving a service request from a user, and determining identification data of the user; searching for a corresponding format converter in a database according to the identification data; The parameters in the request are converted, and a response is made based on the converted service request. In this embodiment, the code logic of parameter conversion and encapsulation is centralized in one service for unified processing, which can flexibly process and encapsulate parameters. Even if the parameter format changes, it is only necessary to modify the corresponding configuration file without modifying the program code. The change realizes the development and deployment of general public services, and the complete decoupling of the custom data parameter format that supports multiple users without interfering with each other, saving resources for deploying services.

The invention provides a capacitive micro-electromechanical system (MEMS) accelerometer, which comprises a first silicon cover plate layer, a middle silicon layer and a second silicon cover plate layer which are arranged in sequence, wherein the middle silicon layer comprises a first silicon island and a second silicon island; the silicon islands are formed inside a silicon framework and separated from the silicon framework at intervals; the first silicon island is contacted with a metal electrode of the first silicon cover plate layer; the second silicon island is contacted with a metal electrode of the second silicon cover plate layer; the first silicon cover plate layer further comprises a first metal electrode through hole, a second metal electrode through hole and a silicon electrode through hole which are formed in a first silicon substrate; the first metal electrode through hole corresponds to the position of the first silicon island; the second metal electrode through hole corresponds to the position of the second silicon island; the silicon electrode through hole corresponds to the position of the silicon framework; and an insulating layer is arranged on the inner wall of each through hole, and each through hole is filled with metal electrically conductive material. By adopting the capacitive MEMS accelerometer, all electrodes of the accelerometer can be led out on the same silicon surface, so that wafer level bonding of the accelerometer is realized and the accelerometer can be packaged by adopting the flip chip technology.