53results about How to "Flexible packaging" patented technology

This invention provides a semiconductor flip chip package including a carrier substrate and a flip chip electrically coupled to the carrier substrate by a plurality of interconnections. A first input / output (I / O) terminal of the semiconductor flip chip package and a bond wire electrically couple the first I / O terminal to a first interconnection of the plurality of interconnections at a first surface of the carrier substrate. The semiconductor flip chip package is more flexible and is lower in cost.

A vehicle has a waste heat recovery (WHR) system and an engine. The WHR system includes a WHR working fluid circuit with a pump, a power turbine, and a condenser. An engine coolant circuit circulates coolant between the engine and an engine coolant heat exchanger / working fluid boiler in the WHR working fluid circuit. At least one exhaust gas heat exchanger / superheater in the WHR working fluid circuit receives waste heat from an exhaust circuit and / or from an exhaust gas recirculation circuit. A working fluid cooled charge air cooler in the WHR working fluid circuit receives waste heat from compressed charge air in a charge air intake circuit. A recuperator may transfer waste heat from working fluid passing from the power turbine to the condenser to working fluid passing from the working fluid cooled charge air cooler to the engine coolant heat exchanger / working fluid boiler.

The invention discloses a method and a device for processing user requests, and relates to the technical field of computers. A specific implementation of the method includes: receiving a service request from a user, and determining identification data of the user; searching for a corresponding format converter in a database according to the identification data; The parameters in the request are converted, and a response is made based on the converted service request. In this embodiment, the code logic of parameter conversion and encapsulation is centralized in one service for unified processing, which can flexibly process and encapsulate parameters. Even if the parameter format changes, it is only necessary to modify the corresponding configuration file without modifying the program code. The change realizes the development and deployment of general public services, and the complete decoupling of the custom data parameter format that supports multiple users without interfering with each other, saving resources for deploying services.

The invention discloses a Bo-deer fast food, belonging to the field of healthcare foods. The Bo-deer fast food is prepared from main components, such as venison and yam, and medical and edible dual-purpose auxiliary materials, such as cinnamon, lily, tuckahoe, solomonscal rhizome, root of kudzu vine, semen coicis, polygonatum, donkey-hide gelatin, mulberry, dark plum pulp, black sesame, lotus leaf, lotus seed, Chinese date pulp and the like. The Bo-deer fast food is prepared by the following steps of: drying, grinding and thinning, cooking to remove mildew and the like, and finally preparing dried powdery fast-food type fast foods. The prepared fast food is portable, is convenient to eat and has the effects of tonifying the spleen and benefiting vital energy, nourishing the liver and enriching the blood, warming the kidney and strengthening yang and the like; in addition, with the Bo-deer fast food, fatigue can be effectively resisted, senescence can be slowed down, and middleaged andelderly people can keep excellent mental status.

The invention provides a capacitive micro-electromechanical system (MEMS) accelerometer, which comprises a first silicon cover plate layer, a middle silicon layer and a second silicon cover plate layer which are arranged in sequence, wherein the middle silicon layer comprises a first silicon island and a second silicon island; the silicon islands are formed inside a silicon framework and separated from the silicon framework at intervals; the first silicon island is contacted with a metal electrode of the first silicon cover plate layer; the second silicon island is contacted with a metal electrode of the second silicon cover plate layer; the first silicon cover plate layer further comprises a first metal electrode through hole, a second metal electrode through hole and a silicon electrode through hole which are formed in a first silicon substrate; the first metal electrode through hole corresponds to the position of the first silicon island; the second metal electrode through hole corresponds to the position of the second silicon island; the silicon electrode through hole corresponds to the position of the silicon framework; and an insulating layer is arranged on the inner wall of each through hole, and each through hole is filled with metal electrically conductive material. By adopting the capacitive MEMS accelerometer, all electrodes of the accelerometer can be led out on the same silicon surface, so that wafer level bonding of the accelerometer is realized and the accelerometer can be packaged by adopting the flip chip technology.