Semiconductor flip chip package

Abstract

This invention provides a semiconductor flip chip package including a carrier substrate and a flip chip electrically coupled to the carrier substrate by a plurality of interconnections. A first input / output (I / O) terminal of the semiconductor flip chip package and a bond wire electrically couple the first I / O terminal to a first interconnection of the plurality of interconnections at a first surface of the carrier substrate. The semiconductor flip chip package is more flexible and is lower in cost.

Description

technical field [0001] The present invention relates to semiconductor packaging, and more particularly to semiconductor flip-chip packaging. Background technique [0002] In general, flip-chip technology is widely used in various consumer products where the form factor is particularly important, such as mobile phones, camcorders (camcorders) or personal digital assistants (Personal Digital Assistant, PDA). The need for performance and the ability to use flip-chip designs to achieve smaller dies are driving the use of flip-chip packaging in many applications. Smaller die means a higher number of die per wafer. While flip-chip assembly has brought benefits to high-performance components, its cost has also become a major challenge for mainstream applications. Therefore, much effort needs to continue to be made to reduce costs. [0003] figure 1 A top view of a flip-chip package with specific bump options according to the prior art. figure 2 for along figure 1 Schematic d...

AI Technical Summary

Problems solved by technology

[0005] The high cost of the flip-chip package described above is partly due to the need for a different bump mask for each bump option

Additionally, IC design houses often encounter nasty die revision management issues when keeping flip-chip die in stock

This is because different bump choices result in different die versions

Due to the nature of flip chip packaging, once the bump selection is utilized and the die version is determined, there is no way to change or redo it

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