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Packing box for glass base plates, and packed composition

A glass substrate and packaging box technology, applied in packaging, transportation and packaging, packaging of vulnerable items, etc., can solve problems such as low safety factor and glass substrate damage, and achieve the effect of saving cost, reducing stress concentration and improving safety factor.

Inactive Publication Date: 2007-05-09
INNOCOM TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In order to solve the above-mentioned problems of stress concentration of the glass substrate packaging box, damage to the glass substrate caused by external force impact, and low safety factor during transportation, it is necessary to provide a method that avoids stress concentration, buffers damage to the glass substrate caused by external force impact, and improves Glass substrate packaging box with safety factor during transportation
[0013] In order to solve the problems of damage to the glass substrate of the above-mentioned packaging combination and low safety factor during transportation, it is necessary to provide a glass substrate packaging that prevents damage to the glass substrate, buffers the damage caused by external impact on the glass substrate, and improves the safety factor during transportation. combination

Method used

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  • Packing box for glass base plates, and packed composition
  • Packing box for glass base plates, and packed composition
  • Packing box for glass base plates, and packed composition

Examples

Experimental program
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Embodiment Construction

[0030] Please refer to FIG. 2 , which is a three-dimensional exploded schematic diagram of a packaging combination of a glass substrate disclosed in a preferred embodiment. This exploded view expresses the main structure of the packaging combination in the least amount. The packaging combination 2 includes a composite body 21 and a packaging box 20 (see FIG. 3 ). The composite body 21 includes two spacers 212 and a glass substrate 211 stacked on top of each other. The packaging box 20 includes a box body 201 and a cover body 202 , the box body 201 and the cover body 202 fit and nest together to form a receiving space. The stacked body 21 is accommodated in the accommodation space formed by the box body 201 and the cover body 202 .

[0031] The box body 201 of the packaging box 20 is a box body with a bottom, and the box body 201 includes four inner walls 2011 , a bottom 2012 and four outer walls 2013 . The four outer walls 2013 are respectively perpendicular to the bottom 2...

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PUM

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Abstract

A packing box of glass substrates and its packing assembly are disclosed. Said packing assembly has at least one glass substrate, at least one isolating plate and a packing box with a buffer structure on the inner surface of its bottom for preventing the glass substrate from being damaged by external vibration or collision.

Description

【Technical field】 [0001] The invention relates to a packaging box and a packaging combination, in particular to a packaging box and a packaging combination for transporting glass substrates. 【Background technique】 [0002] With the development of digital technology, liquid crystal display products have been widely used in all aspects of daily life. For liquid crystal display modules, the role played by the glass substrate is like a chip in the semiconductor industry. Therefore, the requirements of the liquid crystal display industry for glass substrates are almost perfect. [0003] Glass is a brittle material. When it is hit by an external force or dropped to the ground, it is easy to break and become unusable. The glass substrate can be a liquid crystal glass substrate, a plasma display glass substrate, or a general glass substrate, and can also be used to transport backlight panels, color filter panels, and the like. Taking the glass substrate as a liquid crystal glass s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D85/48B65D81/02H05F1/00B65D21/02
Inventor 高淑惠万鸿明蔡耀栋庄政道钟文凯杨弘文
Owner INNOCOM TECH SHENZHEN
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