Packaging antenna, communication device and preparation method of packaging antenna

Abstract

The invention discloses a packaging antenna. The packaging antenna comprises a chip, a carrier, a coating part and an antenna body, wherein a data transmission line is arranged on the surface of and inside the carrier; at least one chip is mounted on one side surface of the carrier; the chip is electrically connected with the data transmission line; the coating part coats the chip and is fixedly connected with the carrier; the coating part extends towards the outer side of the carrier to form a curved surface or a plane; the antenna body is electrically connected with the data transmission line so as to realize data transmission between the antenna body and the chip; the antenna body comprises one or more radiation surfaces; and the antenna body is mounted on the outer surfaces of or inside the carrier and the coating part. The packaging antenna has the technical characteristics that the packaging is simple, the antenna arrangement is flexible, the radiation angle is wide, and the installation is flexible.

Description

technical field [0001] The invention belongs to the technical field of communication, and in particular relates to a packaged antenna, a communication device and a preparation method of the packaged antenna. Background technique [0002] The structure design of antenna in package (Antenna in Package, AIP) belongs to the integration technology of semiconductor chip and radiating antenna, and is a technology of integrating antenna and semiconductor chip based on packaging materials and processes. The structural design of AIP has received more and more attention. [0003] Judging from the current existing AIP structure design, there are still deficiencies, specifically as follows: [0004] 1) The current carrier is a multi-layer chip structure or a plate structure. Since the antenna can only be arranged on the surface of the chip carrier or the plate carrier, when there are multiple independent antennas forming an antenna array, the radiation surface of each independent antenn...

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Problems solved by technology

For example, in the attached Figure 17 In the existing packaged antenna scheme, the width a of the chip is generally not less than 3 mm, and the width of the AIP antenna is usually not less than 5 mm, and the thickness c of the communication equipment is usually not less than 8 mm. In recent years, communication equipment, especially For mobile terminal communication equipment such as smart phones, in order to meet the market demand, the thickness of the mobile phone is getting thinner and thinner. Obviously, this traditional chip package antenna solution cannot meet the market demand, and has certain restrictions on ultra-thin communication equipment;

[0007] 4) At present, the preferred material for preparing the carrier board is mostly BT resin. The reason is that it is limited by the current process design and the problem of thermal matching with the chip, which leads to limited materials for the preparation of packaged antennas and a technology with limited scope of application. question

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