The invention discloses a high-frequency and high-speed
ceramic leadless shell for parallel
seam welding, and relates to the technical field of
semiconductor packaging devices. The shell comprises a
ceramic part, a sealing ring and a
metal cover plate, wherein a back grounding
metal pattern is arranged on the back of the
ceramic part, a plurality of grounding terminals protruding outwards are arranged on the back grounding
metal pattern, radio-frequency
signal transmission pads are arranged between the grounding terminals, a front grounding metal pattern is connected with the back grounding metal pattern via an internal or external metallic
interconnection hole, a front grounding wire is connected with the back grounding metal pattern via an internal or external metallic
interconnection hole, and radio-frequency
signal transmission wires are connected with the radio-frequency
signal transmission pads via separate external or external and internal combined metallic
interconnection holes. The shell is low in echo loss and
insertion loss and good in flatness in band, does not have
resonance points, can realize a parallel
seam welding sealing mode, reduces the difficulty and the cost of a sealing process, guarantees high reliability and high
air tightness, and is favorable for batch application.