Sensor base

Abstract

The present invention discloses a sensor base. The sensor base comprises a base main body, a lateral passage, a first connecting pipe and a second connecting pipe; one end portion of the first connecting pipe is inserted into the base main body, and the other end portion of the first connecting pipe protrudes out from one end surface of the base main body; the other end surface of the base main body is communicated with one end portion of the first connection pipe through a first passage; one end portion of the second connecting pipe is inserted into the base main body, and the other end portion of the second connecting pipe protrudes out from one end surface of the base main body; and the other end surface of the base main body is communicated with one end portion of the second connecting pipe through a second passage. With the sensor base provided by the invention adopted, a plurality of sensors can be encapsulated, and the plurality of sensors can independently form a composite parameter sensor without the matching of other film box parts required; the base main body can communicate with the atmosphere through a plurality of passages; oil-filled cavities are arranged between the sensors and the sensor base; and a circuit board is arranged at the rear sides of the sensors.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a multi-chip porous sensor base. Background technique [0002] The currently used pressure / differential pressure sensor package base has the following defects: 1, 2 or less oil-filled tubes (holes), only one or two sensors can be packaged, and only one of the two sensors can be vented to the atmosphere ( Gauge pressure), the actual use is limited in the occasions with high precision requirements; 2. It can only be used for differential pressure sensors with diaphragm boxes, and the traditional pressure packaging process cannot be extended: the fast resistance welding sealing process cannot be used for pressure alone Sensor base. Contents of the invention [0003] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide a sensor base to improve its scope of application. [0004] To achieve the above object, the sensor base pro...

AI Technical Summary

Problems solved by technology

[0002] The currently used pressure / differential pressure sensor package base has the following defects: 1, 2 or less oil-filled tubes (holes), only one or two sensors can be packaged, and only one of the two sensors can be vented to the atmosphere ( Gauge pressure), the actual use is limited in the occasions with high precision requirements; 2. It can only be used for differential pressure sensors with diaphragm boxes, and the traditional pressure packaging process cannot be extended: the fast resistance welding sealing process cannot be used for pressure alone sensor base

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