36results about How to "Does not affect wiring" patented technology

The invention provides a multi-stopband ultra-wideband antenna based on a semi-module substrate integrated waveguide cavity, relating to an ultra-wideband antenna technology which can be applied in short distance wireless communication and data transmission. The multi-stopband ultra-wideband antenna comprises two layers of dielectric substrates. A lower metal copper foil (10) is arranged on the lower surface of a lower dielectric substrate (5). An intermediate metallic layer (7) and a binding layer (6) are arranged between the lower dielectric substrate and an upper dielectric substrate (4). A disc antenna (1), a microstrip feeder (2) and a microstrip impedance transformation line (3) which are produced by the metal copper foil are laid on the upper surface of the upper dielectric substrate. The disc antenna (1) is connected with the microstrip feeder (2) via the microstrip impedance transformation line (3). Land of the disc antenna (1) is consisted of the intermediate metallic layer (7). A semi-module cavity (11) is consisted of the intermediate metallic layer (7), the lower metal copper foil, the lower dielectric substrate and a metalized via hole (12) connecting the intermediate metallic layer (7) and the lower dielectric substrate. An internal metalized via hole (13) is arranged in the semi-module cavity.

The invention discloses a sound-transmission LED display screen applied to a large-sized LED screen and a sound transmission method. The display screen comprises a PCB and a plurality of light-emitting pixels arranged on the PCB, wherein the light-emitting pixels are surface-mounted light-emitting diodes and are fixed on a light-emitting surface of the PCB through adhesion, each adjacent four light-emitting pixels form a group and are adhered to the light-emitting surface of the PCB, and a sound-transmission hole penetrating through the PCB is formed in the middles of each adjacent four light-emitting pixels. According to the sound-transmission LED display screen, the areas of the sound-transmission holes are greatly increased, and the sound-transmission holes are formed by virtue of limited space among the light-emitting pixels, so that a good sound transmission effect is achieved, the wire distribution of the light-emitting pixels is not influenced, and meanwhile, the sound-transmission LED display screen has good sound transmission rate.

The invention provides a portable electrocardiogram monitoring system which comprises a signal monitoring unit and a computing unit. The signal monitoring unit comprises a control unit, an electrode end and a lead wire for connecting the electrode end and the control unit. The computing unit comprises a wireless data receiving unit, a data processing unit, a storage unit and a display unit, wherein an electrocardio-signal acquired by the signal monitoring unit is transmitted to the data processing unit through the wireless data receiving unit of the computing unit, the data processing unit extracts the electrocardio-signal by means of an electrocardio-signal extracting algorithm and meanwhile transmits the electrocardio-signal to the storage unit and the display unit, and the display unit is used for displaying an electrocardiogram. The portable electrocardiogram monitoring system is provided with a wireless transmitting-receiving module by optimizing a circuit structure, limitation of a mode that the lead wire is connected with a display terminal is eliminated, sensing and the electrocardiogram displaying can be separated, and convenience is achieved. The portable electrocardiogram monitoring system is further provided with a single chip microcomputer and the like, a using range of the system is widened, and domestic usage and other applications are facilitated.

This invention disclosed a back-plate with through-hole plugging-in device. This back-plate contains PCB, crimp connection socket and through-hole plugging-in device. The PCB is connected with the crimp connection socket, and the crimp connection socket is connected with the through-hole plugging-in device. The crimp connection socket's induced plug is plugged into the cavity of the PCB hole, the coordination between them formed with stationary fit. This invention also disclosed an assembling method for through-hole plugging-in devices.

The invention discloses a data processing method and device for applying fluorescent powder to an LED (light-emitting diode) and a manufacturing method of the device, which are used for solving the problem of precisely applying the fluorescent powder against each chip and keeping the consistency in product quality. The technical scheme in the invention is as follows: the data processing method comprises the following steps: generating a chip data file: processing parameters of optical characteristics of each chip in a collected chip group, and generating the data file for being implemented by a system or being further processed; and generating a fluorescent powder distribution data file: performing data processing on the data file, and generating the fluorescent powder distribution data file against the amount of the fluorescent powder required for each chip according to data in the data file. A chip product applying the technology in the invention has the characteristics of being good in consistency, more humanized, more stable and more convenient to process.

The invention provides a vehicle Internet of things monitoring system which comprises a tire detector, a monitoring device and an intelligent mobile phone, wherein the monitoring device is independent, can be movably arranged in a vehicle, and comprises a micro control unit, and a radio frequency receiving module, a display device, an alarm sounding unit, an operation interface, a detection unit,an Internet of things communication module and a positioning receiving module which are respectively connected with the micro control unit; the vehicle Internet of things monitoring system further comprises a power unit; the tire detector and the monitoring device transmit information through the radio frequency receiving module; the monitoring device and the intelligent mobile phone transmit theinformation through the Internet of things communication module. According to the vehicle Internet of things monitoring system provided by the invention, on the basis of a tire pressure monitoring system, the detection unit, the Internet of things communication module and the positioning receiving module are added, so that the vehicle Internet of things monitoring system has a safety protection information detection function, a far-end notification function and a tracking positioning function, is not required to be connected with the vehicle through a connecting wire, is not required to be provided with connecting wires, is easy to use, cannot affect wiring and functions of the original vehicle, and realizes resource sharing.

The embodiments of the invention disclose a large-current printed circuit board and a machining method thereof. The large-current printed circuit board machining method may comprises the following steps: the slotting process is performed on a false layer to form a slot for accommodating a large-current conductor block; the large-current conductor block is placed in the slot; the false layer is laminated between a first sheet set and a second sheet set, wherein the first sheet set and / or the second sheet set comprises at least one layer of circuit pattern layer; and the large-current conductor block is in connection and conduction with the circuit pattern layer in the first sheet set and / or the second sheet set. According to the scheme of the embodiments of the invention, the PCB reliability can be improved, and the occupation of the large-current conductor block on the circuit layer wiring space can be reduced.

The invention relates to a multi-wire cutting machine which at least comprises a bed, a working panel and a rear panel. Three sheaves which are distributed to form a pyramid are mounted on the working panel, a pay-off wheel, a take-up wheel and four guide wheel connecting rods are mounted on the rear panel, two guide wheels are respectively mounted on two sides of each guide wheel connecting rods, a plurality of reverse wheels are further arranged among the sheaves and the guide wheels, and steel wires are paid off by the pay-off wheel, then sequentially pass a guiding wheel, the multiple guide wheels, the reverse wheels and the three sheaves and form a group of parallel steel wires, and then the group of parallel steel wires is led out of the sheaves and is guided to the take-up wheel via the multiple reverse wheels and the multiple guide wheels to be closed. The multi-wire cutting machine is characterized in that the lengths of the guide wheel connecting rods which are far away from the pay-off wheel and the take-up wheel are at least two times the lengths of existing guide wheel connecting rods, and the lengths of the guide wheel connecting rods which are close to the pay-off wheel and the take-up wheel are at least 1.3 times the lengths of the existing guide wheel connecting rods. The multi-wire cutting machine has the advantages that the distances among the adjacent guide wheels are increased to a great extent, so that stress on the steel wires among the adjacent guide wheels can be effectively relieved, tension on the steel wires is uniform, and the steel wires are not easy to break.

The invention discloses a novel flow guide groove structure for a cabinet inner machine. The flow guide groove structure comprises a water receiving groove, a flow guide hole, a flow guide groove andribs. The water receiving groove is formed in the outer side of a skeleton of the cabinet inner machine in a surrounding manner. The two ends of the water receiving groove incline inwards. The water receiving groove comprises a bottom connected with the skeleton and a side portion connected with the bottom. The side portion is bent outwards relative to the bottom. The flow guide hole is formed inthe front face of the skeleton of the cabinet inner machine and located in the center of the water receiving groove. The flow guide groove is formed in the inner side of the skeleton of the cabinet inner machine. The flow guide groove is located right behind the flow guide hole to enable the front portion and the rear portion of the skeleton to communicate. The two sides of the flow guide groove are provided with the ribs. The flow guide groove is arranged to be of a structure shaped like the inverted arable number seven. A lower moving part is arranged in a cavity of the flow guide groove toachieve the waterproof effect. The flow guide groove comprises a horizontal section and a vertical section. The horizontal section is located on the rear portion of the water receiving groove and located above the lower moving part of the cabinet inner machine. The vertical section is located on the back of the lower moving part of the cabinet inner machine, a water receiving disc on a chassis isconnected under the vertical section, and condensation water passes over the moving part and flows in the water receiving disc on the base.

The invention provides production equipment of paper pulp molding bio-based waterproof and oil-proof tableware and discloses a molding and cold-pressing dehydration mesh-free hot drying two-station all-in-one machine. A forming lower die and a cold-pressing upper die are oppositely arranged at a first station, a drying lower die and a drying upper die are oppositely arranged at a second station; so that physical high-strength dewatering is conducted through pressurization of the cold-pressing upper die, the water content of a formed blank is reduced to 55%-60%, and bursting of a product blankis avoided; the cold pressing upper die and the forming lower die or the drying lower die are assembled, and the drying upper die and the drying lower die are assembled to suck products and transfer the products to a collecting device for stacking and counting. Cold high-pressure dehydration is realized by the lower forming die and the upper cold pressing die; according to the two-station all-in-one machine for the paper pulp molding bio-based waterproof and oil-proof tableware, the water content of a product blank is reduced, the drying lower mold and the drying upper mold do not need to be subjected to hot drying with a net, heat energy consumption is reduced, the paper pulp molding bio-based waterproof and oil-proof tableware meets the international BPI fluorine-free standard, energy issaved, efficiency is high, and the equipment size is reduced.

The invention discloses a face shield of an LED (Light-Emitting Diode) display module, which comprises a face shield plate and a plurality of clamping parts, wherein the clamping parts are arranged at the inner side of the face shield plate at intervals, and the clamping parts are used for clamping LED devices inside display modules adjacent to the clamping parts. The face shield of the LED display module, which is disclosed by the invention, can be clamped with the LED devices through the clamping parts when applied to the LED display module, thereby realizing the nonporous connection, decreasing the installation procedures and solving the problems of uneven appearance and inconsistent light reflection caused by perforation without influencing the wiring of a circuit substrate. The invention also discloses a connection method of the face shield of the LED display module and the LED devices and the LED display module.

The invention discloses an equipment management system and a management method thereof. The management system comprises an acquisition device which is configured to acquire current information in an equipment main cable; a control device which is internally provided with current thresholds of the equipment in different states, wherein the control device is configured to receive the current information acquired by the acquisition device, compare the acquired current information with the corresponding current threshold and judge the state of the equipment; and an execution device which comprisesan alarm device, wherein when the control device judges that the standby time of the equipment exceeds the set time, the alarm device gives an alarm, and after the user inputs the standby reason, thealarm device release the alarm. The management system is simple in construction and low in cost, a user can flexibly define the standby reason, a shutdown device can be additionally arranged when necessary, the user is forcibly required to input the standby reason every time standby alarm is given, or otherwise, the equipment cannot be started, and therefore, the performability is higher.

The invention discloses a magnetic induction coil wiring structure and a magnetic induction type electronic target. According to the electronic target, a sheet-shaped protrusion extending into a target body is arranged at the position, corresponding to each partition line, of a bottom plate, and the sheet-shaped protrusions corresponding to the radial partition lines and sheet-shaped protrusions corresponding to the annular partition lines penetrate through each other to form net-shaped protrusions used for containing a magnetic induction coil set. According to the electronic target, startingfrom the bottom plate in a breakthrough mode, the net-shaped protrusions extending into the target body are arranged, the wiring mode of the target surface structure is not affected, wiring machiningis facilitated, and meanwhile the occupied effective scoring space of the target surface is small.

The invention provides a battery management system for an electronic vehicle. The battery management system comprises a plurality of battery module sampling units, a high-voltage sampling unit, an insulation sampling unit and a control unit, wherein the battery module sampling units are used for measuring the voltage of each battery cell in corresponding battery module of the battery module sampling units in real time, and sending to the control unit through interior CAN (Controller Area Network); the high-voltage sampling unit is used for measuring the high-voltage direct-current bus voltage and current of the battery cells and the voltage of fuse end in real time and sending to the control unit through the interior CAN network; the insulation sampling unit is used for measuring insulation resistors of the battery cells and total high-voltage components in real time and sending to the control unit through the interior CAN network; the control unit is used for carrying out balance management on the battery cells, carrying out fault diagnosis on a high-voltage contactor and a fuse of the electronic vehicle and carrying out on-off control on a high-voltage loop of the electronic vehicle, and monitoring the values of the insulation resistors of the battery cells and the total high-voltage components in real time. Correspondingly, the invention provides the electronic vehicle comprising the battery management system. The battery management system disclosed by the invention is high in sampling precision and convenient to maintain.

The invention discloses an LPDDR wafer RDL design method suitable for multi-chip failure analysis, and belongs to the field of semiconductor packaging, and the method comprises the following steps: S1, based on a conventional LPDDR RDL design, adding a bonding welding position; s2, designing a packaging substrate, and adding a plurality of substrate front golden fingers for DIE connection; s3, packaging is carried out, the bonding welding positions are connected with the golden fingers on the front face of the substrate, S4, resistance is measured, the DIE state is judged through resistance testing, and design is completed. When the original RDL wiring is designed, the following RDL wiring is synchronously added; an unclosed square-shaped wire and two bonding pads (proper positions need to be found for the windowing positions of the bonding pads, and RDL wiring of an original product is not affected) are additionally arranged around the periphery of the DIE, whether the DIE cracks or not is judged through measurement data of wire resistance, a special testing machine is not needed, and the cost is reduced. The cracking of a certain DIE in the multi-chip stack can be judged only by using a universal meter or a simple test device to test the resistor.

The invention provides a packaging substrate of an embedded passive assembly. The packaging structure comprises a core board, a dielectric layer unit, a positioning pad, a passive assembly, a first line layer and a second line layer. The core board is provided with an opening, and the dielectric layer unit wraps the core board, full-fills the opening of the core board, and is provided with an upper surface and a lower surface. The positioning pad is embedded in the lower surface of the dielectric layer unit. The upper surface and lower surface of the passive assembly are provided with a plurality of electrode pads, and the passive assembly is embedded in the dielectric layer unit, arranged in the opening of the core board, and corresponds to the positioning pad. The first line layer is arranged on the upper surface of the dielectric layer unit, and a first conducting blind hole is electrically connected between the first line layer and the electrode pads arranged on the upper surface of the passive assembly. The second line layer is arranged on the lower surface of the dielectric layer unit, and a second conducting blind hole is electrically connected between the second line layer and the electrode pads arranged on the lower surface of the passive assembly. The passive assembly is embedded in the core board and the dielectric layer unit, thereby effectively lowering the height of the overall structure.

A circuit board, comprising a first metal layer, a first electromagnetic shielding layer, a circuit substrate, a second electromagnetic shielding layer and a second metal layer stacked in sequence; the circuit board also includes a conduction structure arranged along the stacking direction, The conduction structure is arranged around the periphery of the circuit board and electrically connected to the first metal layer and the second metal layer. A conductive metal layer and a second conductive metal layer. The circuit board has electrostatic protection performance.

The embodiment of the invention discloses a display panel and a manufacturing method thereof. The display panel comprises a substrate; a thin film transistor layer formed on the substrate; a planarization layer formed on the thin film transistor layer; the display panel comprises a planarization layer, and is characterized in that the display panel further comprises a light-emitting element and a pinning structure which are formed on the planarization layer, the light-emitting element and the pinning structure are located in a pixel area and a pinning area of the display panel respectively, and the pinning structure comprises a groove; and the packaging layer covers the light-emitting element and the pinning structure, and at least partial area of the packaging layer is embedded in the groove.

The invention provides a three-dimensional textile driving system, which includes a plurality of corner guide wheels that can be embedded with yarn carriers, and each corner guide wheel is correspondingly provided with a set of drive systems to drive its rotation, and each set of drive systems is provided with an independent support The box body, the support box body is provided with a multi-stage gear transmission module, the multi-stage gear transmission module is connected to the rotating main shaft, the main shaft is connected with an angle guide wheel, and the rotation of the main shaft drives the angle guide wheel to rotate. Each corner guide wheel in the textile drive system is equipped with a corresponding drive system, so that the drive system only needs to drive the main shaft to rotate, so that the structure of each drive system is relatively simple and the rotation is relatively stable. In addition, each drive system is provided with a support box for support, and a stable transmission is performed through a multi-stage gear transmission module with a simple structure.

The invention discloses a printed circuit board (PCB) and a differential signal line wiring method based on the PCB. The differential signal line wiring method based on the PCB comprises the steps that signal wiring of a differential signal line on a first layer of the PCB among matching impedance, a via hole and a functional module is laid; signal wiring of a differential signal line on a second layer of the PCB among matching impedance, a via hole and a functional module is laid; commands are received, and according to command indication, a first functional module is communicated with a second functional module or the first functional module is communicated with a third functional module. According to the PCB and the differential signal line wiring method based on the PCB, wiring complexity in function expansion of the PCB can be reduced.

The embodiment of the present invention discloses a high-current printed circuit board and a processing method thereof, wherein, a processing method of a high-current printed circuit board may include: slotting a dummy layer to form a slot for accommodating a large-current conductor block ; Place the large current conductor block in the groove; Laminate the dummy layer between the first sheet set and the second sheet set, the first sheet set and / or the second sheet set include at least one circuit pattern layer; The large current conductor block is connected and conducted with the circuit pattern layer in the first plate set and / or the second plate set. The solution of the embodiment of the present invention is beneficial to improve the reliability of the PCB, and reduce the occupation of the circuit layer wiring space by the large current conductor block.

The invention discloses a display screen module and a display screen, the display screen module comprises a plurality of box bodies and a plurality of lamp panels arranged on the box bodies, the lamp panels and the adjacent lamp panels are spliced to form the box bodies, and the box bodies and the adjacent box bodies are spliced to form a screen. Each lamp panel comprises a PCB substrate and a plurality of pixel points arranged on the front face of the PCB substrate in an array mode, and an open hole penetrating through the PCB substrate is formed between every four adjacent pixel points. According to the display module provided by the embodiment of the invention, the Mini LED huge screen is realized in a lamp panel splicing manner, and the PCB substrates are provided with the open holes, so that the problem that the sound transmission effect of the loudspeaker is blocked by a huge screen splicing screen is solved; the holes are formed among the four adjacent pixel points, and wiring among the pixels is not affected by the holes; by controlling the shape, the size and the number of the holes, the requirement of a cinema for the sound pressure level can be met.

The present invention provides a method for conversion of a Flash memory cell on a first semiconductor device to a ROM memory cell in a second semiconductor device, the first and second semiconductordevice each being arranged on a semiconductor substrate and each comprising an identical device portion and an identical wiring scheme for wiring the device portion to the Flash memory cell and to theROM memory cell, respectively; the Flash memory cell being made in non-volatile memory technology and comprising an access transistor and a floating transistor, the floating transistor comprising a floating gate and a control gate; the ROM memory cell being made in a baseline technology and comprising a single gate transistor, which method includes manipulating a layout of at least one baseline mask as used in the baseline technology; the manipulation including: incorporating into the layout of the at least one baseline mask a layout of the Flash memory cell, and converting the layout of theFlash memory cell to a layout of one ROM memory cell by eliminating, from the at least one baseline mask, a layout for the floating transistor from the layout of the Flash memory cell and designatingthe layout of the access transistor of the Flash memory cell as a layout of the single gate transistor of the ROM memory cell.

The invention relates to the technical field of treadmills and particularly relates to a special roller for an anti-static treadmill. The special roller comprises a roller body, a power generation device, a voltage transformation device and a static elimination device, and utilizes continuous rotation of the roller to generate induced electromotive force when the treadmill is started to excite the static elimination device after voltage transformation of the voltage transformation device. The static electricity eliminating device ionizes air in the roller body to enable the air to be rich in positive and negative ions, the air containing a large number of positive and negative ions can neutralize static electricity existing in a belt, a running belt and other components after being exhausted through the ventilation holes, wiring of the treadmill cannot be affected, and the air rich in positive and negative ions can permeate to all positions of the treadmill; practical significance and popularization value are achieved, and it is expected that good economic benefits can be generated.

The multi-stop-band ultra-wideband antenna based on the half-mode substrate integrated waveguide cavity relates to an ultra-wideband antenna technology applicable to short-distance wireless communication and data transmission, including two layers of dielectric substrates, and the lower dielectric substrate (5) The lower surface is provided with a lower metal copper foil (10), an intermediate metal layer (7) and an adhesive layer (6) are provided between the lower dielectric substrate and the upper dielectric substrate (4), and the upper dielectric substrate The upper surface is laid with a disk antenna (1), a microstrip feeder (2), and a microstrip impedance transformation line (3) made of metal copper foil. The disk antenna (1) is connected to the microstrip impedance transformation line (3) and The microstrip feeder (2) is connected, and the ground of the disc antenna (1) is formed by the middle metal layer (7); the half-mold cavity (11) is made of the middle metal layer (7) and the lower metal copper foil, the lower dielectric The substrate is composed of a metallized through hole (12) connecting the middle metal layer (7) and the lower metal copper foil, and an inner metallized through hole (13) is also provided in the half-mold cavity.