The invention relates to the field of electromagnetic wave shielding films, in particular to an ultrahigh-frequency electromagnetic wave shielding film without a chemical
electroplating process and conductive particles, and a manufacturing method of a circuit board comprising the film. The shielding film at least comprises an
alloy shielding layer, wherein the outer surface of one side of the
alloy shielding layer is coated with a pure
adhesive layer; one or more of specially-processed coarsening insulation
layers are arranged on the outer surface of the other side of an
alloy shielding grounding layer; a carrier film layer is arranged on the outer surface of an insulating film layer; and the lower surface of a conductive
adhesive layer is covered with a protection film. According to the shielding film, the pure
adhesive film layer of the shielding film does not contain conductive particles, so that the cost can be lowered, and the
insertion loss is reduced; and the pure adhesive filmlayer is punctured through the
rough surface of the alloy shielding layer to realize grounding, so that extremely high shielding efficiency is achieved, the overall
shielding effect is improved,
pollution to the environment is reduced, the
energy consumption is reduced, and the cost is lowered.