Winding type PVD physics deposition vacuum magnetron sputtering silver-plated copper alloy layer method

Abstract

The invention discloses a winding type PVD physics deposition vacuum magnetron sputtering silver-plated copper alloy layer method. The winding type PVD physics deposition vacuum magnetron sputtering silver-plated copper alloy layer method comprises the following steps of purification preprocessing on the surface of a PET basal lamina, vacuum pumping, filling inert gas, heating, sputtering and compounding a plurality of metal layers and the like. The aggregate thickness of the magnetron sputtering silver-plated copper alloy layer is quite thin, and production time is effectively saved; and thesurface layer of the PET basal lamina can achieve the effect of current conduction, electromagnetic wave protection and shielding signal interference, a compound alloy layer can greatly improve the barrier property between a conducting layer and external media, the overall shielding effect is improved by the electromagnetic wave protection and the shielding signal interference.

Description

technical field [0001] The invention relates to the technical field of electromagnetic wave protection and signal interference shielding, in particular to a winding-type PVD physical deposition vacuum magnetron sputtering silver-plated copper alloy layer method. Background technique [0002] Due to the extreme demand for light and thin electronic communication products, the requirements for electromagnetic wave protection and signal interference shielding are getting higher and higher. The traditional sputtering process generally only sputters one kind of metal layer, which has a large resistance and cannot achieve high 5G communication. request etc. There are also many problems in the traditional electroplating process. Electroplating also contains certain toxic and harmful substances. The processing process is complicated, the processing cost is high, and there is still some pollution to the environment. High energy consumption, complex process, low production efficiency,...

AI Technical Summary

Problems solved by technology

[0002] Due to the extreme demand for light and thin electronic communication products, the requirements for electromagnetic wave protection and signal interference shielding are getting higher and higher. The traditional sputtering process generally only sputters one kind of metal layer, which has a large resistance and cannot achieve high 5G communication. request etc.

There are also many problems in the traditional electroplating process. Electroplating also contains certain toxic and harmful substances. The processing process is complicated, the processing cost is high, and there is still some pollution to the environment.

Large energy consumption, complex process, low production efficiency, high cost, and not environmentally friendly