Electric connector and manufacturing method therefor

Abstract

The invention discloses an electric connector used for being electrically connected with a chip module. The electric connector comprises a body, at least one bump, a metal layer and multiple terminals, wherein the body has multiple accommodating holes and an upper surface; the at least one bump protrudes out of the upper surface upwardly; an insulating part is positioned on the bump and used for supporting the chip module; the metal layer covers the upper surface and the periphery of the bump; the multiple terminals are accommodated in the accommodating holes and used for being connected with the chip module in a conduction manner; the metal layer covers the upper surface and the periphery of the bump; the insulating part is positioned on the bump for supporting the chip module, so that it is ensured that the metal layer can better shield crosstalk among the terminals to satisfy high-frequency signal transmission of the terminals; and meanwhile, contact between the metal layer and the chip module also can be avoided, so that short circuit of the chip module can be prevented.

Description

technical field [0001] The invention relates to an electrical connector and a manufacturing method thereof, in particular to an electrical connector with a shielding effect and a manufacturing method thereof. Background technique [0002] With the rapid development of computer technology, the number of terminals of LGA electrical connectors is increasing, which causes the terminals to be arranged very closely, making it easy to generate signal interference between terminals. In order to shield the signal interference between terminals, a commonly used in the industry The electrical connector is used to electrically connect a chip module to a circuit board. It includes a body on which a plurality of bumps are integrally formed to support the chip module. The body is provided with a plurality of signal receiving slots and A plurality of grounding storage slots, a plurality of signal terminals and a plurality of grounding terminals are respectively stored in the signal storage ...

AI Technical Summary

Problems solved by technology

[0003] However, in the process of coating the upper surface of the body with a metal layer, the surface of the bump is also coated with a metal layer, so when the chip module is supported on the bump, it is located on the top surface of the bump. The metal layer will contact the chip module, causing the chip module to short circuit

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