Large-current printed circuit board machining method and large-current printed circuit board

Abstract

The embodiments of the invention disclose a large-current printed circuit board and a machining method thereof. The large-current printed circuit board machining method may comprises the following steps: the slotting process is performed on a false layer to form a slot for accommodating a large-current conductor block; the large-current conductor block is placed in the slot; the false layer is laminated between a first sheet set and a second sheet set, wherein the first sheet set and / or the second sheet set comprises at least one layer of circuit pattern layer; and the large-current conductor block is in connection and conduction with the circuit pattern layer in the first sheet set and / or the second sheet set. According to the scheme of the embodiments of the invention, the PCB reliability can be improved, and the occupation of the large-current conductor block on the circuit layer wiring space can be reduced.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a processing method of a high-current printed circuit board and a high-current printed circuit board. Background technique [0002] In many scenarios, high-power printed circuit boards (PCB, Printed Circuit Board) are required, such as high-power power amplifier PCBs, automotive electronics PCBs, and other electronic products that require high current (such as current > 5A or 30A) and signals. [0003] At present, such PCBs carrying large currents usually use conductor blocks carrying high currents to be directly embedded in the circuit layer (wherein, the conductor blocks carrying high currents can be referred to as high-current conductor blocks, and the large-current conductor blocks are, for example, copper block) way to carry a large current, due to the extremely harsh environment of high current use, there will be many problems in terms of long-term reliability. F...

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Problems solved by technology

For example, burrs may be generated when making high-current conductor blocks, and the distance between high-current conductor blocks and other holes and lines may be relatively close. Therefore, in the long-term high-current working process, short circuits and other defects are prone to occur due to electro-chemical migration, which makes the reliability of the PCB Not good; moreover, the high-current conductor block is directly buried in the circuit layer, which takes up more space in the circuit layer and affects the wiring

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