Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

circuit board

A technology for circuit boards and circuit substrates, applied in circuit devices, printed circuit components, and crosstalk/noise/electromagnetic interference reduction (and other directions) to avoid performance failures, strengthen electrostatic protection, and prolong service life.

Active Publication Date: 2022-06-24
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] People in the industry usually shield the electrostatic shielding effect by covering the two surfaces of the printed circuit board with a shielding film layer. However, the electrostatic protection effect achieved by the above method does not completely prevent the circuit board from electrostatic interference.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • circuit board
  • circuit board
  • circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0028] Some embodiments of the present invention will be desc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A circuit board, comprising a first metal layer, a first electromagnetic shielding layer, a circuit substrate, a second electromagnetic shielding layer and a second metal layer stacked in sequence; the circuit board also includes a conduction structure arranged along the stacking direction, The conduction structure is arranged around the periphery of the circuit board and electrically connected to the first metal layer and the second metal layer. A conductive metal layer and a second conductive metal layer. The circuit board has electrostatic protection performance.

Description

technical field [0001] The present invention relates to a circuit board. Background technique [0002] Electrostatic discharge refers to the transfer of charge caused by objects with different electrostatic potentials approaching or directly contacting each other. Sensitive circuit components can easily be damaged by electrostatic discharge. Especially for printed circuit boards, the existing printed circuit boards often use a large number of integrated circuit components, which have high electrostatic sensitivity, low withstand voltage, and weak electrostatic shock resistance, so they are easily damaged by electrostatic discharge, and even further affect. The normal operation of the entire electronic device system. Therefore, it is necessary to protect the printed circuit board from static electricity and release the static electricity in time. [0003] People in the industry usually use shielding films on both surfaces of the printed circuit board to shield against stat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0218
Inventor 李成佳杨梅袁刚
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products