Disclosed is an
electret condenser microphone capable of
surface mounting which has a structure highly resistant to high temperature. The
electret condenser microphone comprises a case, a polar ring, a diaphragm, a spacer, a back-plate, a first base, a second base and a
printed circuit board (PCB), wherein the first base surrounds the diaphragm, the spacer and the back-plate, so that the first base prevents characteristics of an
electret formed on any one of the diaphragm and the back-plate from being deteriorated in a reflow process for
surface mounting. Further, in order to prevent sensitivity of the electret
condenser microphone from being lowered due to decrease of an electrical potential value of the electret in the reflow process. High
gain IC devices are used. The electret condenser
microphone capable of
surface mounting can be obtained by, first, using main components made from a high-temperature resistant insulating material, for example, a
polymer-, a plastic- or a fluoro resin-based material, second, constructing the first base to surround acoustic based components, third, using a cream solder for high temperature to bond components to the PCB, fourth, using the high
gain IC devices, fifth, providing the connecting terminal with gas
discharge grooves and protruding the connecting terminal to be higher than a curled surface of the electret condenser
microphone.