305 results about "High power electronics" patented technology

The invention discloses an environmental-protection anti-corrosive heat-dissipation powder paint, and a preparation method and application thereof. The environmental-protection anti-corrosive heat-dissipation powder paint comprises the following raw materials in parts by weight: 40-90 parts of matrix resin, 2-40 parts of curing agent, 0.5-10 parts of carbon nanotube, 0.5-2 parts of additive, 0-4.5 parts of hexagonal boron nitride, 0-15 parts of aluminum nitride, 0-10 parts of magnesium nitride, 0-10 parts of silicon carbide and 5-30 parts of pigment and filler. The composition and proportioning of the raw materials of the powder paint disclosed by the invention are scientific and reasonable. The experimental result indicates that the powder paint has the advantages of favorable heat-dissipation effect, high efficacy enhancement rate (higher than 60%) and favorable cooling effect (more than 20 DEG C), and can effectively solve the problem of poor heat-dissipation effect in the high-power electronic product, thereby prolonging the service life of the electronic product. The powder paint disclosed by the invention is free of organic solvent, and is environment-friendly and safe; the powder paint disclosed by the invention also has favorable comprehensive properties, such as flexibility, hardness, adhesive force and the like, and stable chemical properties; and the coating formed by the powder paint has the advantages of high corrosion resistance and shock resistance, favorable insulation property and wide application range.

A method for forming a carbon nanotube array on a metal substrate includes the following steps: providing a metal substrate (11); depositing a silicon layer (21) on a surface of the metal substrate; depositing a catalyst layer (31) on the silicon layer; annealing the treated substrate; heating the treated substrate up to a predetermined temperature in flowing protective gas; introducing a carbon source gas for 5-30 minutes; and thus forming a carbon nanotube array (51) extending from the treated substrate. Generally, any metallic material can be used as the metal substrate. Various carbon nanotube arrays formed using various metal substrates can be incorporated into a wide variety of high power electronic device applications such as field emission devices (FEDs), electron guns, and so on. Carbon nanotubes formed using any of a variety of metal substrates are well aligned, and uniformly extend in a direction substantially perpendicular to the metal substrate.

A method for forming a carbon nanotube array using a metal substrate includes the following steps: providing a metal substrate (11); oxidizing the metal substrate to form an oxidized layer (21) thereon; depositing a catalyst layer (31) on the oxidized layer; introducing a carbon source gas; and thus forming a carbon nanotube array (61) extending from the metal substrate. Generally, any metallic material can be used as the metal substrate. Various carbon nanotube arrays formed using various metal substrates can be incorporated into a wide variety of high power electronic device applications such as field emission devices (FEDs), electron guns, and so on. Carbon nanotubes formed using any of a variety of metal substrates are well aligned, and uniformly extend in a direction substantially perpendicular to the metal substrate.

The invention discloses an embedded strong-current high-power PCB (Printed Circuit Board) and a manufacturing method thereof. The method comprises: (1) milling a hollow groove on a core board; (2) fixedly clamping and embedding a conductor structure member which is same as the hollow groove in shape and not larger than the core board into thickness in the hollow groove; (3) laminating a first copper foil layer on the upper surface of the core board by a first semicuring piece, and laminating a second copper foil layer on the lower surface of the core board by a second semicuring piece; (4) drilling the laminated product, performing image transfer and image making on the first and second copper foil layers, forming a circuit needed by design and a part meeting large power and circuit control on the copper foil layers, simultaneously, performing hole metallization on the formed through hole to obtain the thickness of copper needed on the hole wall, and then performing solder masking manufacture; and (5) performing blind-sink hollowing on corresponding parts, needing to be connected on the product, of the conductor structure member after solder masking, exposing the conductor structure member, drilling the conductor structure member to form wire holes connected with other external connecting pieces. Compared with the prior art, in the invention, the conductor structure member is embedded into the inner layer of the PCB, interconnection of a large-current output end and an instrument input end by utilizing holes or surfaces on the conductor structure member, simultaneously, component packaging is performed by other circuit part lines except the high-power conductor structure member embedded into the PCB so as to control the circuit, so that the original wire connection is replaced to achieve the circuit control part, and the problems in the integration process of the power and circuit control parts of strong-current high-power electronic products are solved.

The invention discloses an atomizer and an electronic smoking device. The atomizer comprises a shell, an electric conduction part arranged on the shell and a suction nozzle with a gas outlet, a liquid storage cavity used for containing tobacco liquid is formed in the interior of the shell, the shell is further internally provided with at least one heating element which is electrically connected with the electric conduction part, each heating element comprises a liquid conduction carrier with a micropore structure and a heating part which forms an integral structure with the liquid conduction carrier, and the liquid conduction carrier can make contact with the tobacco liquid; the heating elements heat and atomize the tobacco liquid sucked by the liquid conduction carrier through the capillary action. The heating elements in the atomizer have the functions of sucking the tobacco liquid and heating simultaneously, and the atomizer is simple in structure and capable of being applied to high-power electronic smoking devices.

A high temperature hybrid-circuit structure includes a temperature sensitive device which comprises SiC, AlN and / or AlxGa1-xN(x>0.69) connected via electrodes to an electrically conductive mounting layer that is physically bonded to an AlN die. The die, temperature sensitive device and mounting layer, which can be a thin film of W, WC or W2C less than 10 micrometers thick, have temperature coefficients of expansion within 1.06 of each other. The mounting layer can consist entirely of a W, WC or W2C adhesive layer, or an adhesive layer with an overlay metallization having a thermal coefficient of expansion not greater than about 3.5 times that of the adhesive layer. Applications include temperature sensors, pressure sensors, chemical sensors and high temperature and high power electronic circuits. Without the mounting layer, a thin film piezoelectric layer of SiC, AlN and / or AlxGa1-xN(x>0.69), less than 10 micrometers thick, can be secured to the die.

The invention relates to radiating technology applied to fully sealed electronic cabinets, in particular to a radiating method and a radiating device applied to high power electronic equipment required to be fully sealed in outdoor severe environment. The invention adopts a cooling liquid circular cooling device; cooling liquid absorbs heat generated when power elements work through a liquid-cooled radiator arranged in a mainframe; a recycle liquid pump conveys the cooling liquid having absorbed the heat into a high-efficiency radiator outside the mainframe; and a fan of the high-efficiency radiator performs enforced air cooling on the cooling liquid so as to achieve the aim of high-efficiency radiating, wherein the mainframe adopts a fully sealed cabinet structure so as to achieve the waterproof, dampproof, dustproof and electromagnetic shielding aims. The device adopting the radiating technology has the advantages of high power, small volume, easy control of temperature, low noise, low cost, high heat exchange efficiency and the like.

Rechargeable cells in cylindrical form are arranged within frames in a honeycomb structure and coupled by connecting straps outside the frames to form cell pack. Several cell packs, an electronic switch and control circuit are integrated into the battery housing. A bus bar extends around the perimeter of the housing. A high density MOSFET switch is coupled between the bur bar and the battery contact. A high power electronic clamp disposed across the battery terminals absorbs or redirects transients. An active, high-efficiency, low-noise cell balance converter or a LC based resonant converter may also be provided. For advanced battery applications a +5V CAN bus interface is provided via two circular connectors. Thermistors are provided for use in a thermal protection scheme.

The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.