37results about How to "Solve ills" patented technology

The invention discloses a lock adding method to a data conflict module in a cooperative editing, locking within editing position scope of each cooperator must be recognized by the chief editing node of the belonged group, each cooperator only has one lock, and can carry through various editing operations randomly within the locking range; each node is stored with a locking table of group member, when the local locking operation is happening, firstly scanning the local locking table to check whether conflict exists, if yes, PRI judging can be passed through, and then judging result of adding lock can be sent to the chief editing node and arbitrated by the chief editing node; the invention brings forward a humanized lock adding method, so that not only the efficiency of cooperative editing can be improved, but also the conflict can be flexibly processed; the lock adding method has easy realization, solves defects of original technical scheme and has good expansibility; the invention also provides an elastic data conflict solution, and is able to satisfy cooperative requirements of multi-people distributed type cooperative editing.

The invention relates to a self-crosslinking organosilicone heat-resistant coating capable of reaching good drying properties and excellent physical and chemical properties through a self-crosslinking reaction. The self-crosslinking organosilicone heat-resistant coating is characterized in that the coating is prepared from the following raw materials in parts by weight: 50-60 parts of modified organosilicone resins with a concentration not less than 60%, 0.3 part of dispersant BYK, 0.4 part of organic bentonite, 10-15 parts of pigment, 5-10 parts of mica powder with a particle size of 350-450meshes, 5-10 parts of precipitate barium sulfate with a particle size of 350-450 meshes, 5-10 parts of talc powder with a particle size of 350-450 meshes and 10-20 parts of xylene; and the coating can achieve good drying properties and excellent physical and chemical properties through a self-crosslinking reaction in a 25 DEG C environment. Through the coating, the shortcomings of the existing one-component organosilicone products are solved, the coating has good heat resistance, and simultaneously the coating layer formed by the coating has excellent mechanical strength and protective properties. The coating provided by the invention is adaptable to the decorative protection of large-sized heat-resistant components, the components coated by the coating can withstand the temperature of 450 DEG C for a long term and can withstand long-term UV (ultraviolet) exposure, and the coating layer is not damaged.

The invention relates to a method for detecting circulating tumor cells: collecting human body fluid samples, fixing with formaldehyde to increase cell membrane permeability, adding cells into several groups of PCR multiplex tubes, each tube is added with a reverse transcription primer carrying ID1, and reverse transcription After the cDNA molecules are recorded, the cells are collected and mixed into another set of PCR multiplex tubes. Each tube is added with an extension primer carrying ID2 and the 3' end can specifically recognize the 3' end of the cDNA molecule, and the extension reaction is carried out after sequence complementation. , cells were harvested and lysed, and extension products were pre-amplified by PCR primers. High-throughput sequencing to analyze the combination of ID1:ID2. Its advantages are: simultaneous reverse transcription and PCR amplification of different markers can accurately identify circulating tumor cells and circulating tumor cells with EMT, and can be used in combination with other technologies to detect the few circulating tumors in body fluid samples to the greatest extent. cells and other non-humoral rare cells.

The invention relates to the field of tunnel shield construction, in particular to a parallel construction method for a shield arrival tunnel portal ring beam and a shield crossing station. According to the parallel construction method for the shield arrival tunnel portal ring beam and the shield crossing station, the problems of long construction period and high cost because tunnel portal ring beam construction is carried out after the shield tunnel of the traditional station is finished are solved. The parallel construction method for the shield arrival tunnel portal ring beam and the shield crossing station comprises the following steps of: reserving a pump pipe on a middle plate and a top plate of the station; during shield arrival, carrying out secondary after-grouting to the back of a pipe piece by polyurethane; cancelling zero ring pipe piece splicing; after a shield tail leaves the tunnel portal ring beam, overlaying I steel on tunnel portal ring steel; welding a steel plate on the I steel; erecting a groined type rack platform on the tunnel portal steel ring; binding the tunnel portal ring beam reinforcing steel bar; installing an annular template and an end tip template; and directly pouring tunnel portal ring beam concrete by a station embedded pump pipe. Tunnel portal ring beam and shield tunneling can be synchronously carried out, and the influence on the shield tunneling by the tunnel portal ring beam construction is avoided. The parallel construction method for the shield arrival tunnel portal ring beam and the shield crossing station has the advantages of simple technology, advanced technology, flexible working procedure regulation, no construction interference and favorable economic benefit and social benefit.

The invention discloses a chip structure and a manufacturing method. The chip structure comprises a chip substrate, a first signal gasket, a second signal gasket, a first hole, a dielectric material and a packaging material, wherein a first surface of the chip substrate is provided with the first signal gasket and the second signal gasket; on a second surface of the chip substrate, the first holeis etched at a position corresponding to the second signal gasket; the first hole passes through the chip substrate and a metal conductive material is filled in the first hole; the dielectric materialand the chip substrate are arranged at a preset distance interval; a part of the packaging material wraps the chip substrate and the dielectric material, the packaging material is exposed at a side of the dielectric material, the side of the dielectric material is the same with the sides of the first signal gasket and the second signal gasket, and a first signal line is arranged on the packagingmaterial and the second signal gasket; and the side of the packaging material, which is different from the sides of the first signal gasket and the second signal gasket, is provided with a second signal line. In the invention, based on double-sided wiring of a silicon through hole, wiring difficulty of packaging is reduced, simultaneously high frequency and low frequency signals are separated so that crosstalk among the signals is reduced.