61results about How to "Shorten wiring distance" patented technology

Disclosed here is a multi-chip module enhanced in performance and reduced in size. A second semiconductor chip having bonding pads at the periphery of its surface is mounted over a first semiconductor chip laid out over a surface of a substrate back to back and a spacer is provided at a portion of the second semiconductor chip surface except for a predetermined area that includes the portion where the bonding pads are formed while a third semiconductor chip is mounted over the spacer, the third semiconductor having the same circuit function as the second semiconductor chip and oriented similarly to the second semiconductor chip. The bonding pads of the second and third semiconductor chips are connected to their corresponding electrodes formed over the substrate through bonding wires respectively, then the first to third semiconductor chips and the bonding wires provided over the substrate are all sealed by a sealing agent.

In a directional speaker control system for realizing good sound localization by correcting the directivity of a directional speaker, adapted to an audio surround system in which a desired sound is reflected on a wall surface or a sound reflection board so as to produce a virtual speaker, a first directional speaker emits a first sound toward the wall surface or sound reflection board so that the reflected sound reaches a prescribed listening position, and a second directional speaker emits a second sound, which comes to have an inverse phase with respect to an audio element of the first sound reaching the listening position directly, toward the listening position. Thus, it is possible to adequately dampen the audio element (particularly, low-frequency components) emitted directly toward the listening position from the first directional speaker; hence, it is possible to realize good sound localization.

A multi-chip module is provided which allows memory space extension to improve function and performance. A first semiconductor chip is mounted on a mounting substrate, and a first semiconductor memory chip is mounted over the first semiconductor chip. A second semiconductor memory chip having the same circuitry and the same memory capacity as the first semiconductor memory chip is mounted on a spacer formed on the first memory chip in the same direction as the first semiconductor memory chip. An electrode is independently formed corresponding to a bonding pad to which a selective signal of the first semiconductor memory chip and the second semiconductor memory chip is supplied. A plurality of electrodes are formed in common corresponding to a plurality of bonding pads to which the same signal is respectively supplied except for the selective signal.

An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.

The invention provides a method, structure and terminal for stacking a fingerprint module and a display screen, and the structure comprises the fingerprint module, the display screen and a touch screen which are longitudinally arranged on the same position in a stacking way. According to the invention, the wiring distance and the head space of the terminal are saved through stacking the fingerprint module, the display screen and a touch screen on the same position, so that the screen proportion can be further extended.

A chip embedded packaging structure includes a first metal board, a second metal board having at least a through cavity, in which the second metal board is disposed on the upper surface of the first metal board to form a heat dissipating substrate, at least a semiconductor chip and a capacitor chip embedded in the first metal board and embraced in the through cavity of the second metal board, a passive component layer disposed on part of the upper surface of the second metal board, and at least a build-up circuit layer covering the semiconductor chip, the capacitor chip, and the passive component layer and electrically connecting them through a plurality of conductive vias.

In a printhead element board including a plurality of printing elements which align in a predetermined direction, driving circuits which drive the printing elements, and an element selection circuit which selects printing elements within each group for each group having a predetermined number of adjacent printing elements, a plurality of element selection circuits are laid out adjacent to the driving circuits of the respective groups. With this layout, even if the number of printing elements increases, only the length in the printing element array direction increases without increasing the length in a direction perpendicular to the printing element array direction.

Anodized films are formed at both surfaces of an aluminum base and, at the center portion on each side of the aluminum base, a solid electrolyte layer of a conductive polymer, a graphite layer, and a metal layer are stacked in the order, thereby forming a rectangular cathode portion. An insulator layer is formed at the peripheries of four sides of the cathode portion and, further, an anode lead frame is provided at the peripheries of four sides of the upper insulator layer, thereby forming an anode portion. Openings are formed at four corners of the insulator layer or the anode portion, thereby establishing electrical connection between the cathode portions on both sides of the aluminum base. By setting the ratio of a total region, occupied by the openings, of the cathode portion to 25% or less, the ESL of a capacitor can be suppressed low even when the openings are provided.

A tire condition detection device is arranged such that a tire condition detection signal detected on a tire side of a vehicle is received by a receiving antenna and entered into a receiver on the vehicle body side of the vehicle. The receiving antenna and the receiver are electrically connected to each other via a metal part of the vehicle. The tire condition detection signal received by the receiving antenna is transmitted to the receiver via the metal part used as a waveguide.

In a personal watercraft with a watercraft body including a hull forming a bottom portion and a deck covering the hull from above, a magnet box is integrally combined with a battery storage tray. The watercraft also includes an engine disposed within the watercraft body, and a saddle-type seat disposed above the engine. A magnet box, including a main box body and a lid member, sealingly stores an electromagnetic starter switch therein, and is disposed in front of a battery storage tray, in order to reduce the distance between the magnetic starter switch and a starter motor. The main box body is formed integrally with a battery storage tray which is disposed in back of the engine and fixedly disposed on a floor portion of the watercraft body. The lid member is adapted to sealingly close the main box body of the magnet box in a fluid-tight manner.

Each semiconductor radiation detector used for a nuclear medicine diagnostic apparatus (PET apparatus) is constructed with an anode electrode A facing a cathode electrode C sandwiching a CdTe semiconductor member S which generates charge through interaction with γ-rays. Then, a thickness t of the semiconductor member S sandwiched between these mutually facing anode electrode A and cathode electrode C is set to 0.2 to 2 mm. Furthermore, the devices are mounted (laid out) on substrates in such a way that the distance (distance of conductor) between the semiconductor radiation detector and an analog ASIC which processes the signal detected by this detector is shortened. Furthermore, the substrates on which the detectors are mounted are housed in a housing as a unit (detector unit).

The first synchronous FF is disposed at the starting point of the clock tree of the frequency-divided clock of each lower hierarchical block, and the first maximum delay time of the reference clock from the branch point of the reference clock and the frequency-divided clock to the first synchronous FF is acquired. The second maximum delay time of the reference clock between adjacent two of second synchronous FFs is determined so as to be less than half the period of the reference clock. The number of stages of the second synchronous FFs is determined according to the first and second maximum delay times. The target delay time from the branch point is determined so as to be not more than the second maximum delay time, and the second synchronous FF and a latch are disposed so as to achieve the target delay time.

A semiconductor device is provided with: a semiconductor chip die-bonding mounted face up on a support; an intermediate substrate connecting the semiconductor chip to a plurality of external connection portions; and a plurality of connection bumps connecting the semiconductor chip and the intermediate substrate. The plurality of connection bumps includes a plurality of power supply bumps connected to a plurality of electrode pads on the semiconductor chip for supplying power to the semiconductor chip. The intermediate substrate includes: a plurality of power supply pads connected to the plurality of electrode pads through the plurality of power supply bumps; a bump surface facing the semiconductor chip and having a plurality of power supply pads formed thereon; an external connection surface having a plurality of external connection pads formed thereon connected to the external connection portions; and a capacitor connected to the plurality of power supply bumps.

Disclosed herein is an inductor module including a substrate functioning as a printed wiring board or an interposer; an IC mounting part formed on a surface of the substrate; an inductor which is formed in the substrate at such a position as to overlap with the IC mounting part on a plan-view basis and which is connected to an IC mounted on the IC mounting part; and a magnetic body including a magnetic material selected from among a NiZn ferrite, a NiZnCu ferrite and a Ba ferrite, the magnetic body being disposed intermediately between the IC mounting part and the inductor.

The invention provides a high-isolation triple-coaxial leaky coaxial cable. The isolating performance of the cable is excellent and the original main radiation signal is enhanced, so that the same-row wiring distance between leaky cables can be shortened substantially; and thus leaky cables can be distributed in a limited space area, so that the area meets the signal coverage requirement. The provided leaky coaxial cable comprises an inner conductor, an inner insulation layer, an inner-layer outer conductor, an outer insulation layer and a sheath successively from the center to the outer ring surface and is characterized in that a gap notch is formed in the inner-layer outer conductor and the gap radian alpha formed by the gap notch is 0 to 0.5 pi, wherein the gap radian alpha decreases with increasing of an optimal operating frequency; and an outer-layer outer conductor is arranged at an outer ring position corresponding to the gap notch, wherein the outer-layer outer conductor is a piece of arc metal. The corresponding center axes of the outer-layer outer conductor, the inner-layer outer conductor, and the inner conductor are overlapped. The outer-layer outer conductor is arranged at the outer side of the inner-layer outer conductor; and the arc radian beta of the outer-layer outer conductor is larger than the gap radian alpha.

A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.