43results about How to "Shape influence" patented technology

The invention discloses an aluminum steel window anti-collision treatment device and a using method thereof, and belongs to the technical field of aluminum steel window anti-collision. The aluminum steel window anti-collision treatment device comprises a pair of L-shaped protective frames clamped to the outer end of an aluminum steel window frame, wherein the L-shaped protective frames comprise U-shaped clamping plates clamped to the outer end of the aluminum steel window frame, the outer ends of the U-shaped clamping plates are fixedly connected with a pair of parallel inner-layer buffer cotton, and outer-layer buffer rubber is arranged at the ends, away from the U-shaped clamping plates, of the inner-layer buffer cotton. According to the aluminum steel window anti-collision treatment device and the using method thereof, the L-shaped protective frames are arranged on the outer side of the aluminum steel window frame, when an external object collides with the L-shaped protective frames, on the one hand, the collision force can be weakened for the first time from the front side through elastic deformation, on the other hand, the action direction of the collision force is changed through circulating rolling of balls, secondary weakening of the collision force is achieved, collision damage of the external object to the aluminum steel window frame is greatly reduced through doubleweakening of the L-shaped protective frames to the collision force, and double protection of the aluminum steel window frame is achieved.

The invention discloses a method for preparing a metal-organic framework material film, and belongs to the technical field of preparation of inorganic-organic hybrid films. The method comprises the following specific steps: enabling a ZrC14 solution to react with a 2-aminaterephthalic acid solution to prepare UiO-66-NH2; adding methacrylic anhydride to obtain modified UiO-66-NH2; adding modified UiO-66-NH2 in an acrylate organic monomer, adding a photoinitiator, and irradiating under UV light to obtain the metal-organic framework material film. The method is a simple and fast MOF film processing method, self-supported MOFs hybrid films of different polymer systems are synthetized, MOFs particles and the polymer systems are bonded, and the MOF particles are dispersed uniformly in the polymer systems. The method is simple, fast, and low in raw material cost, and has industrialized advantages.

The invention discloses a waterproof cable connector, which comprises two electric joints, a cable connected at the rear ends of the electric joints, and an inner shell and an outer shell wrapped at the rear ends of the electric joints, wherein the front ends of the electric joints protrude forwards and extend out of the outer shell; the joints of the rear ends of the electric joints and the cable are wrapped in the inner shell, and the outer shell is wrapped and formed on the periphery of the inner shell again; the middle part of each electric joint is provided with an accommodating groove, and the front part of the accommodating groove is provided with a screwing part; and a nut and a waterproof shim are correspondingly sleeved on each electric joint, wherein the waterproof shim is correspondingly sleeved on the periphery of the accommodating groove of the electric joint, and the nut is correspondingly screwed on the screwing part of the electric joint and is used for pressing and fixing the waterproof shim to the front end face of the inner shell. Gaps between the electric joints and the inner shell are sealed to prevent external water from entering the inner shell through the periphery of the electric joints.

The invention relates to the technical field of red brick embossing, and discloses an auxiliary device for red brick embossing used in construction, including a main body of the embossing device, a support plate is movably connected to the main body of the embossing device, and the right part of the support plate is fixed A connecting rod is installed, a first extruding plate and a first elastic air bag are arranged above the connecting rod, a second extruding part is arranged on the left part of the supporting plate, and a second elastic air bag is arranged under the second extruding part, so A workbench is arranged below the green press mold, and a cleaning plate is arranged above the workbench. In the initial state, the first elastic airbag shrinks, the second elastic airbag bulges, the first pressing plate moves down, and the first elastic airbag is not squeezed. At this time, the second elastic airbag is squeezed by the second extrusion part. When the moving rod moves to the right to drive the rotating gear to rotate counterclockwise, the counterclockwise rotation of the rotating gear will drive the clearing plate to move left through the tooth column, and the clearing plate moves to the left of the workbench in advance and removes the mud on the workbench.

A forming method of a semiconductor device comprises the steps of providing a substrate, and enabling a first interlayer dielectric layer, a second interlayer dielectric layer and a groove penetrating through the thicknesses of the interlayer dielectric layers to be sequentially formed on the surface of the substrate; processing part of the first interlayer dielectric layer and the second interlayer dielectric layer on a side wall of the groove, respectively forming a first sacrificial layer and a second sacrificial layer, and enabling the width of the first sacrificial layer to be larger than that of the second sacrificial layer; after forming the first sacrificial layer and the second sacrificial layer, filling the groove to form a metal wire layer; after forming the metal wire layer, removing the first sacrificial layer and the second sacrificial layer to form an opening which comprises a first auxiliary opening at the bottom and a second auxiliary opening at the top, and enabling the opening diameter of the first auxiliary opening to be larger than that of the second auxiliary opening; and forming an insulating layer which is covered on the second interlayer dielectric layer and striding the opening. Correspondingly, the invention further provides the semiconductor device formed by adopting the method. Resistance capacitance (RC) effect is low, and performance of a semiconductor integrated circuit is good.

The invention discloses a waterproof cable connector, which comprises two electric joints, a cable connected at the rear ends of the electric joints, and an inner shell and an outer shell wrapped at the rear ends of the electric joints, wherein the front ends of the electric joints protrude forwards and extend out of the outer shell; the joints of the rear ends of the electric joints and the cable are wrapped in the inner shell, and the outer shell is wrapped and formed on the periphery of the inner shell again; the middle part of each electric joint is provided with an accommodating groove, and the front part of the accommodating groove is provided with a screwing part; and a nut and a waterproof shim are correspondingly sleeved on each electric joint, wherein the waterproof shim is correspondingly sleeved on the periphery of the accommodating groove of the electric joint, and the nut is correspondingly screwed on the screwing part of the electric joint and is used for pressing and fixing the waterproof shim to the front end face of the inner shell. Gaps between the electric joints and the inner shell are sealed to prevent external water from entering the inner shell through the periphery of the electric joints.