291results about How to "Increase vapor pressure" patented technology

An implant for use in a human or animal body can include a flexible housing with an outer wall and having a chamber therein. The implant can have at least one high vapor pressure medium within the chamber. The at one high vapor pressure medium can have a combined vapor pressure equal to or greater than about the average value of the hydrostatic pressure of the implantation site plus the skin tension of the housing minus the gas tension of the dissolved gasses present at the implantation site.

The present invention relates to an apparatus and method for rapid flash-like volatilization of high and low vapor pressure components from liquid or solid emanators which is in contact with a point or localized heat source. Vaporization is promoted by a geometrically small electrically resistive heating element with variable activation for pulsed or cyclic heating of an emanating surface containing the volatile components. The apparatus is primarily directed towards the treatment of residential air for fragrancing, odor elimination, treatment of insects or pests, air sanitization, air and surface antibacterial or antimicrobial treatment, or other ambient air or surface modification by way of gas or vapor distribution.

deposition in a formation, wellbore, near wellbore region, and production tubing. Compositions of the invention comprise an asphaltene solvent and a viscosity reducing agent, the asphaltene solvent and viscosity reducing agent present in a ratio so as to substantially reduce viscosity of an asphaltene-containing material while substantially negating deposition of asphaltenes either in a reservoir, in production tubing, or both when mixed or otherwise contacting the asphaltene-containing material Methods of the invention comprise forcing a composition comprising an asphaltene solvent and a viscosity reducing agent to contact an asphaltene-containing hydrocarbon in an underground geologic formation, and producing from the formation a production composition comprising at least some of the treatment composition and at least some of the asphaltene-containing hydrocarbon under conditions sufficient to substantially negate deposition of asphaltenes in the formation.

The invention teaches a practical method of recovering CO₂ from a mixture of gases, and sequestering the captured CO₂ from the atmosphere for geologic time as calcium carbonate and provides a CO₂ scrubber for carbon capture and sequestration. CO₂ from the production of calcium oxide is geologically sequestered. A calcium hydroxide solution is produced from the environmentally responsibly-produced calcium oxide. The CO₂ scrubber incorporates an aqueous froth to maximize liquid-to-gas surface area and time-of-contact between gaseous CO₂ and the calcium hydroxide solution. The CO₂ scrubber decreases the temperature of the liquid and the mixed gases, increases ambient pressure on the bubbles and vapor pressure inside the bubbles, diffuses the gas through intercellular walls from relative smaller bubbles with relative high vapor pressure into relative larger bubbles with relative low vapor pressure, and decreases the mean-free-paths of the CO₂ molecules inside the bubbles, in order to increase solubility of CO₂ and the rate of dissolution of gaseous CO₂ from a mixture of gases into the calcium hydroxide solution.

The CO₂ scrubber recovers gaseous CO₂ directly from the atmosphere, from post-combustion flue gas, or from industrial processes that release CO₂ as a result of process. CO₂ reacts with calcium ions and hydroxide ions in solution forming insoluble calcium carbonate precipitates. The calcium carbonate precipitates are separated from solution, and sold to recover at least a portion of the cost of CCS.

To suppress the adherence of debris as a result of a radiating fuel, such as tin or the like, within a vessel for forming high density and high temperature plasma of an extreme UV radiation source device, and to eliminate deposited tin and/or tin compounds with high efficiency, hydrogen radical producing parts are provided in the vessel; and hydrogen radicals are produced in the vessel so that deposition of tin and/or a tin compound is suppressed in the area with a low temperature of the device, such as a focusing mirror or the like, and the deposited tin and/or tin compound is eliminated.

A thallium-free high pressure ceramic metal halide lamp having superior dimming characteristics with a fill composition comprising MgI2 and CeI3. In addition, the fill chemistry comprises NaI and the halides of rare earth metals such as Dy, Ho and Tm.

Aerosol spray formulations capable of delivering high concentrations of active agent-containing materials and/or excipient are described herein. The formulation contains a carrier fluid, a propellant, and a therapeutic, prophylactic, consmeticeutical and/or inert solid suspended, dissolved, or dispersed in the formulation. The active ingredient may be any pharmaceutically active agent, but is preferably an antibiotic, an antihistamine, an anesthetic, an anti-inflammatory, and/or an astringent. In one embodiment, the active agent is an antifungal agent. In another embodiment, the active agent is a consmeticeutical. The active agent can optionally be dispersed on, or associated with, a carrier powder. The carrier fluid is a highly volatile silicone liquid, which evaporates in less than 10 minutes, preferably less than 5 minutes, after application of the formulation to the patient's skin. The formulation may also contain one or more pharmaceutically acceptable excipients such as antioxidants, stabilizers, perfumes, colorants, viscosifiers, emulsifiers, surfactants, and combinations thereof. The formulation can be packaged in a conventional aerosol spray can.

A laminated structure appropriate for use in constructing walls, floors, ceilings or doors, has a selected area and in one embodiment comprises two external layers of one or more materials such as, but not limited to, gypsum, at least one internal constraining layer having less than said selected area, and two or more internal layers of a viscoelastic glue separated by said at least one internal constraining layer, wherein each of said layers of viscoelastic glue is patterned to cover a selected percentage, but not all, of said area of said laminated structure thereby to allow moisture to pass through said structure.

Small structures are formed by applying to a substrate a structural material and a layer of a sacrificial material having a lower surface energy than the structural material, to form an intermediate product. The substrate is then heated to a temperature at which the sacrificial material evaporates or sublimes and the structural material is mobilized. The sacrificial material is permitted to evaporate or sublime, an area of the substrate covered by the sacrificial material to diminish, and the structural material to agglomerate on the remaining sacrificial material to form a structure.

A method and a deposition system for increasing deposition rates of metal layers from metal-carbonyl precursors using CO gas and a dilution gas. The method includes providing a substrate in a process chamber of a processing system, forming a process gas containing a metal-carbonyl precursor vapor and a CO gas, diluting the process gas in the process chamber, and exposing the substrate to the diluted process gas to deposit a metal layer on the substrate by a thermal chemical vapor deposition process. The deposition system contains a substrate holder configured for supporting and heating a substrate in a process chamber having a vapor distribution system, a precursor delivery system configured for forming a process gas containing a metal-carbonyl precursor vapor and a CO gas and for introducing the process gas to the vapor distribution system, a dilution gas source configured for adding a dilution gas to the process gas in the process chamber, and a controller configured for controlling the deposition system during exposure of the substrate to the diluted process gas to deposit a metal layer on the substrate by a thermal chemical vapor deposition process.

Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.

A novel method and system of separating carbon dioxide from flue gas is introduced. Instead of relying on large temperature or pressure changes to remove carbon dioxide from a solvent used to absorb it from flue gas, the ion pump method, as disclosed herein, dramatically increases the concentration of dissolved carbonate ion in solution. This increases the overlying vapor pressure of carbon dioxide gas, permitting carbon dioxide to be removed from the downstream side of the ion pump as a pure gas. The ion pumping may be obtained from reverse osmosis, electrodialysis, thermal desalination methods, or an ion pump system having an oscillating flow in synchronization with an induced electric field.

A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coating is deposited onto a substrate. The combustion flame can be stable from 10 torr to multiple atmospheres, and provides the energetic environment in which the reagent contained within the fluid can be reacted to form the desired powder or coating material on a substrate. The plasma torch likewise produces the required energy environment, but, unlike the flame, no oxidizer is needed so materials stable in only very low oxygen partial pressures can be formed. Using either the plasma torch or the combustion plasma, coatings can be deposited and powders formed in the open atmosphere without the necessity of a reaction chamber, but a chamber may be used for various reasons including process separation from the environment and pressure regulation.