93results about How to "Increase power gain" patented technology

Provided is a distributed amplifier in communication systems, including: an input transmission line; an output transmission line; an input impedance match and an output impedance match, for providing termination of the input transmission line and the output transmission line, respectively and for preventing signal reflection in the input transmission line and the output transmission line, respectively; multi-stage Gm cells with common mode feedback, the input transmission line being coupled to the output transmission line by the transconductance of the Gm cells; and an input gate bias circuit, for providing bias for the multi-stage Gm cells. In at least one of the Gm cells, one inverter performs V/I conversion while other inverters provide negative resistance to control common mode of output voltage and to enhance DC gain of the Gm cell. Due to common mode feedback, no output gate bias is needed.

A filtering method, a transceiver and a transmitter are provided. The transmitter comprises a power amplifier amplifying an RF signal and having multiple stages, and a local oscillator, the power amplifier comprising between at least two stages of the power amplifier an impedance circuitry for forming an impedance at a frequency related to the frequency of the local oscillator, and a switch for switching the impedance of the impedance circuitry means to RF frequency.

Power amplifiers for amplifying a radio frequency signal are provided. The power amplifier may include an envelope tracking power supply, a carrier amplifier coupled with the envelope tracking power supply and configured to amplify the radio frequency signal, an input matching network configured to split the amplified radio frequency signal from the carrier amplifier such that one part of the amplified radio frequency signal passes along a peak amplifier path and another part of the amplified radio frequency signal passes along an impedance transformer path, a peak amplifier coupled with the envelope tracking power supply and configured to amplify the one part of the amplified radio frequency signal from the input matching network, an impedance transformer configured to perform impedance transformation on the other part of the amplified radio frequency signal from the input matching network, an output matching network configured to combine the output of the peak amplifier and the impedance transformer, wherein the peak amplifier is configured to be switched off in a lower power mode and switched on in a high power mode based at least in part on an input power level of the radio frequency signal. With the claimed solutions, more powerful and efficient power amplifiers that are capable of operating over broader frequency ranges may be achieved.

A heterojunction bipolar transistor, having a structure in which a subcollector layer of a first conductive type having a higher doping concentration than a collector layer, a collector layer of the first conductive type, a base layer of the second conductive type, and an emitter layer of the first conductive type are deposited, in order, on a semi-insulating semiconductor substrate, and in which a hole barrier layer of semiconductor material with a band gap wider than that of the base layer is inserted between the base layer and the collector layer, so as to be in direct contact with the base layer.

A piezoelectric actuator having a bottom electrode attached to a membrane, a piezoelectric layer on the bottom electrode, and a top electrode formed on the piezoelectric layer, wherein the bottom electrode extends substantially over the entire bottom surface of the piezoelectric layer, and at least a peripheral portion of a top surface of the piezoelectric layer and side faces of that layer are covered with an insulating layer, and wherein in the peripheral portion of the top surface of the piezoelectric layer the top electrode is superposed on the insulating layer.

A wideband low-noise amplifier includes a source-degenerated common-source amplifier, a common-gate amplifier, and a matching frequency band determiner. The source-degenerated common-source amplifier is configured to amplify an input signal to output a first signal that is opposite in phase to the input signal. The common-gate amplifier is connected in parallel to the source-degenerated common-source amplifier to amplify the input signal to output a second signal that has the same phase as the input signal. The matching frequency band determiner is configured to isolate an input terminal of the source-degenerated common-source amplifier and an input terminal of the common-gate amplifier and determine a matching frequency band.

The invention discloses a high-efficiency power amplifier with strong anti-mismatch based on transistor stacking technology, which includes a -45° phase-shift input matching network, a +45° phase-shift input matching network, a dual-way balanced three-stack power amplifier network, and a +45° phase-shift input matching network. A ° phase-shifted output matching network, a -45° phase-shifted output matching network, a first supply bias network, and a second supply bias network. The present invention uses a three-stacked transistor amplification network to realize the amplification function of the balanced amplifier, improves the power gain and power capacity of the balanced power amplifier, and uses a three-stage T-type filter phase-shifting circuit to realize the ±45° shift of the two balanced signals Phase control and input and output impedance matching greatly improve the anti-mismatch characteristics of the amplifier under the premise of ensuring low insertion loss and high efficiency, thereby improving the stability and reliability of the circuit. The strong anti-mismatch high-efficiency power amplifier chip circuit realized by the invention has high output power, high power gain and small area.

The invention relates to an arrangement and circuit, and to a method for interconnecting flat rigid or flexible solar cells, the photoelectrically active layers thereof being applied to an insulating substrate material. The solar cells (1) in the arrangement and circuit of flat rigid or flexible solar cells are disposed overlapping in the contact area to one or more adjacent solar cells (1), as is already known as such.; Said solar cells (1) are interconnected to each other directly once or a plurality of times in a novel manner, having a contact material (10) at the overlapping area to each other, using contact material (10) or switching points (22). In the method, an electrically conductive layer is generated on an entire solar cell matrix made of a plurality of overlapping solar cells (1) at individual or, if necessary, selectively at a plurality of (optionally a great many of) switching points (22), by means of screen printing, dispensing, spraying, vaporization, sputtering, or galvanically precipitating. Said layer, or the corresponding number of layers, are then applied pointwise to the corresponding locations so that the back side contact (7) of each of the upper solar cells (1) is connected to the front side contact (17) of the immediately adjacent overlapping solar cell (1).; The contact material (10) can be applied and disposed here as a continuous strand or as individual or a plurality of contacts in one or more switching points (22). The invention can be applied for rigid or flexible solar cells, particularly those produced using thin film technology. Said solar cells can also be individual, discrete solar cells, or also a plurality of so-called monolithically interconnected solar cells on a common substrate material.

A method for monitoring and measuring an insulation resistance in ungrounded and grounded power supply systems includes the method steps of generating a periodic measuring signal, coupling in the measuring signal between active conductors of the power supply system to be monitored and ground, and detecting and evaluating measured values of the measuring signal. In one embodiment of the invention, the generated measuring signal is formed as a multi-frequency signal by the superposition of a finite number of harmonic oscillations with at least three harmonics. Alternatively, the multi-frequency signal can also be realized by means of a targeted, portioned construction of the signal shape in the time domain on the basis of a binary sequence optimization or by generating the measuring signal by means of the time-division multiplexing method.

The invention discloses an RF (radio frequency) transceiver circuit system. The system comprises an on-chip circuit and a matching circuit connected with the on-chip circuit; the matching circuit is in circuit connection with the on-chip circuit through a first port, a second port and a third port; the on-chip circuit comprises a transmitter circuit and a receiver circuit in circuit connection with the transmitter circuit; the first port is in circuit connection with a voltage stabilizer of a receiver and a voltage stabilizer of a transmitter respectively; the second port is in circuit connection the voltage stabilizer of the transmitter and a first-stage amplifier respectively; and the third port is in circuit connection with a second-stage amplifier and a low-noise amplifier. According to the invention, the third port just needs to be arranged on a radio frequency signal channel, and only one inductor is adopted in the matching circuit, so that off-chip matching circuit is simplified and the cost of off-chip components BOM (Bill of Material) is reduced.

A device includes a substrate; a buffer layer on the substrate; a barrier layer on the buffer layer, a source electrically coupled to the barrier layer; a gate electrically coupled to the barrier layer; and a drain electrically coupled to the barrier layer. The device further includes an electron concentration reduction structure arranged with at least one of the following: in the barrier layer and on the barrier layer. The electron concentration reduction structure is configured to at least one of the following: reduce electron concentration around the gate, reduce electron concentration around an edge of the gate, reduce electron concentration, increase power gain, increase efficiency, decouple the gate from the drain, decouple the gate from the source, and reduce capacitance.

A balanced and active coplanar microwave coupler for an MMIC, comprising FETs provided with metal grid, source, and drain electrodes integrated with coplanar plane metal elements combined to constitute the inlet and outlet accesses of the coupler. All of the access are constituted by an association comprising one or more CPSes and one or more CPWs.

A semiconductor device has a plurality of external connection lead terminals including an input lead terminal, an output lead terminal, and an RF grounding lead terminal, a heat dissipation plate connected to the RF grounding lead terminal, a semiconductor device and a printed circuit board each mounted on the heat dissipation plate, and a mold resin for sealing the semiconductor device, the printed circuit board, and the heat dissipation plate such that at least a part of the back surface of the heat dissipation plate is exposed. The semiconductor device amplifies a signal inputted to the input lead terminal and outputs the amplified signal from the output lead terminal.