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164results about How to "High weight ratio" patented technology

Thermal management for a ruggedized electronics enclosure

The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate rigidly coupled to a structural foam layer for providing mechanical support and thermal dissipation for the electronic components. A fluid channel, rigidly coupled to the structural foam, is provided for directing a cooling fluid in the plane of the heat spreader and a bottom plate rigidly coupled to the structural foam to protect the electronic components against one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention relates to a ruggedized electronics enclosure for housing electronic components containing a top compartment configured to house the electronic components. The top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly, rigidly coupled to the top compartment. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events.
Owner:THEMIS COMP

Tamper-resistant tablet providing immediate drug release

InactiveUS20130028972A1Increase relative weight ratioHigh weight ratioBiocideOrganic active ingredientsOxideImmediate release
The invention relates to a tamper-resistant tablet comprising(i) a matrix material in an amount of more than one third of the total weight of the tablet; and(ii) a plurality of particulates in an amount of less than two thirds of the total weight of the tablet; wherein said particulates comprise a pharmacologically active compound and a polyalkylene oxide; and form a discontinuous phase within the matrix material;and method of using said tablet to treat pain and other conditions.
Owner:GRUNENTHAL GMBH

Method of thermoforming fiber reinforced thermoplastic sandwich panels, thermoformed articles, and modular container structure assembled therefrom

A method is disclosed utilizing off the shelf constant cross section thickness sandwich panels comprised of Fiber Reinforced Thermoplastic (FRTP) resin skins and low density thermoplastic (TP) core material wherein the steps of selectively and controllably exposing the panels to heat and incrementally thermoforming the skin-core into a consolidated composite edge or intra-panel area in consideration of subsequent mating and attachment of the FRTP sandwich panel to other structures is achieved. The exact configuration of articles so thermoformed is design optimized to overcome manufacturing, assembly, weight, in-service and structural performance shortcomings of prior art and FRP sandwich panel structures. Further disclosed is an improved, load-bearing, modular design container structure assembled from such thermoformed FRTP sandwich panels in which is utilized the unique core-skin edge configuration of the present invention in consideration of improved: load bearing performance, useful load volume, reduced manufacturing costs, structural weight savings, impact and damage tolerance and repair and replace issues.
Owner:ADVANCED COMPOSITE STRUCTURES LTD

Adhesive with insulating and heat-conducting properties used at ultralow temperature

The invention relates to an adhesive with insulating and heat-conducting properties used at an ultralow temperature, the adhesive being a two-component adhesive obtained by mixing a mixture component A and a curing agent and conducting a curing reaction. Curing conditions of the curing reaction are heating the mixture at a temperature of 25 DEG C for 24 hours and then raising the temperature to 150 DEG C to heat for 6 hours. The mixture component A is a mixture obtained by uniformly mixing 100 parts by weight of epoxy resin, 6 parts by weight of silane coupling agent, and 100-1000 parts by weight of heat-conducting powder filler in a mechanical manner, wherein the heat-conducting powder filler is composed of 0-60 wt% of metallic heat-conducting powder and 40-100 wt% of nonmetallic heat-conducting powder. The adhesive of the invention has excellent insulating and heat-conducting properties at ultralow temperature, can overcome the disadvantages that existing heat-conducting adhesives can not be used at ultralow temperature and has bad heat conductivity at ultralow temperature, contains no diluents added during preparation and causes no pollution induced by micro-molecule volatilization in the cuing reaction.
Owner:TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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