The invention relates to an
epoxy resin sealing material capable of resisting high temperature and
high pressure and a method for preparing the same. The
epoxy resin sealing material consists of an A component and a B component, wherein the A component comprises the
epoxy resin formed by selecting one or more of
bisphenol A type epoxy resin, AG-80 epoxy resin,
hydantoin epoxy resin, p-aminophenol epoxy resin,
bisphenol F epoxy resin, m-metaxylylenediamine epoxy resin, resorcin epoxy resin,
bisphenol AD epoxy resin,
bisphenol S epoxy resin, hydrogenation
bisphenol A type epoxy resin, organic
silicon modification
bisphenol A type epoxy resin, fluorination epoxy resin and o-
cresol-
formaldehyde epoxy resin, and also comprises the components of a thinner, fillers and the like; and the B component is a curing agent. The epoxy resin sealing material can be used for encapsulation and packaging of various electric elements, and besides the functions of fixing,
moisture prevention,
anti corrosion, anti-counterfeiting and the like, the epoxy resin sealing material also has the function of bearing
high pressure at a high temperature, so that the epoxy resin sealing material is widely used.