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Epoxy resin sealing material and method for preparing same

A technology of epoxy resin and potting material, which is applied in chemical instruments and methods, other chemical processes, etc., to achieve the effect of overcoming high temperature resistance and improving heat resistance and hardness

Inactive Publication Date: 2010-04-21
ZHONGHAO CHENGUANG RES INST OF CHEMICALINDUSTRY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing epoxy resin potting compound is difficult to meet the above requirements at the same time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] For the preparation of component A of epoxy resin potting compound, take the following components (both in kilograms):

[0032] Epoxy resin E-51 100

[0033] Phenyl glycidyl ether 12

[0034] Fumed silica 2

[0035] Modified ultrafine barium sulfate 25

[0036] Microsilica 20

[0037] Titanium dioxide 20

[0038] Methicone 2

[0039] Measure and add into the mixing container according to the order of the above formula, stir evenly, and grind twice on the three-roller mill.

[0040] Component A of epoxy resin potting compound: use m-xylylenediamine curing agent.

[0041] The use ratio of A and B components is A:B=100:12; first mix evenly, then potting, and curing at room temperature.

[0042] Effect: The cured product can withstand 225 kg of pressure within 350 seconds at 165 ° C, and the reject rate is less than 5%.

Embodiment 2

[0044] For the preparation of component A of epoxy resin potting compound, take the following components (both in kilograms):

[0045] Epoxy resin E-51 50

[0046] m-xylylenediamine epoxy resin 50

[0047] Phenyl glycidyl ether 30

[0048] Modified ultrafine barium sulfate 25

[0049] Microsilica 40

[0050] Titanium dioxide 40

[0051] Methicone 1

[0052] Measure and add into the mixing container according to the order of the above formula, stir evenly, and grind twice on the three-roller mill.

[0053] Component A of epoxy resin potting compound: use m-xylylenediamine curing agent.

[0054] The use ratio of A and B components is A:B=100:13; first mix evenly, then potting, first curing at room temperature, and then strengthening curing at 100°C for 1 hour.

[0055] Effect: The cured product can withstand 225 kg of pressure within 350 seconds at 165 ° C, and the reject rate is less than 5%.

Embodiment 3

[0057] For the preparation of component A of epoxy resin potting compound, take the following components (both in kilograms):

[0058] m-xylylenediamine epoxy resin 100

[0059] Phenyl glycidyl ether 50

[0060] Fumed silica 3

[0061] Modified ultrafine barium sulfate 50

[0062] Silica powder 50

[0063] Titanium dioxide 60

[0064] Methicone 3

[0065] Measure and add into the mixing container according to the order of the above formula, stir evenly, and grind twice on the three-roller mill.

[0066] Component A of epoxy resin potting compound: use m-xylylenediamine curing agent.

[0067]The use ratio of A and B components is A:B=100:13; first mix evenly, then potting, first curing at room temperature, and then strengthening curing at 100°C for 1 hour.

[0068] Effect: The cured product can withstand 230 kg of pressure within 360 seconds at 170 ° C, and the reject rate is less than 5%.

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PUM

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Abstract

The invention relates to an epoxy resin sealing material capable of resisting high temperature and high pressure and a method for preparing the same. The epoxy resin sealing material consists of an A component and a B component, wherein the A component comprises the epoxy resin formed by selecting one or more of bisphenol A type epoxy resin, AG-80 epoxy resin, hydantoin epoxy resin, p-aminophenolepoxy resin, bisphenol F epoxy resin, m-metaxylylenediamine epoxy resin, resorcin epoxy resin, bisphenol AD epoxy resin, bisphenol S epoxy resin, hydrogenation bisphenol A type epoxy resin, organic silicon modification bisphenol A type epoxy resin, fluorination epoxy resin and o-cresol-formaldehyde epoxy resin, and also comprises the components of a thinner, fillers and the like; and the B component is a curing agent. The epoxy resin sealing material can be used for encapsulation and packaging of various electric elements, and besides the functions of fixing, moisture prevention, anti corrosion, anti-counterfeiting and the like, the epoxy resin sealing material also has the function of bearing high pressure at a high temperature, so that the epoxy resin sealing material is widely used.

Description

technical field [0001] The invention relates to a potting compound, in particular to a high temperature resistant epoxy resin potting compound and a preparation method thereof. Background technique [0002] Epoxy resin has excellent dielectric properties, mechanical properties and adhesive properties, and it is widely used in various fields because of its small curing shrinkage, small linear expansion coefficient, good dimensional stability, and good process performance. [0003] With the continuous development of electronic technology, epoxy resin has become one of the important pillars of the electronic industry. Epoxy resin-based materials are widely used in the bonding, potting, and packaging of electronic components, and play an important role in the fixation, moisture-proof, anti-corrosion, and anti-counterfeiting of electronic components. However, due to the further development of electronic technology, the packaging requirements are getting higher and higher. In add...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08G59/20C08K3/36C08K3/34C08K7/14C08K3/30C08K3/26C08K3/22C08L63/02C08L63/00C09K3/10
Inventor 谭周琴张杰
Owner ZHONGHAO CHENGUANG RES INST OF CHEMICALINDUSTRY CO LTD
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