The invention discloses a high-heat-dissipation multilayer high-frequency
copper-based
microwave signal board and a preparation technology thereof, and belongs to the field of PBC multilayer high-frequency
metal substrates, the high-heat-dissipation multilayer high-frequency
copper-based
microwave signal board comprises a
copper base material and a plurality of circuit
layers, the copper base material comprises a G1 copper base layer and a G2 copper base layer, and the G1 copper base layer and the G2 copper base layer are arranged on the PCB multilayer high-frequency
metal substrate. A heat dissipation groove and a first heat dissipation hole are formed in one side of the G1 copper base layer, a second heat dissipation hole is formed in the G2 copper base layer, the multi-layer circuit layer comprises an L1 circuit core, an L2 circuit layer core, an L3 circuit layer core and an L4 outer layer wire core, the multi-layer circuit layer, the G1 copper base layer and the G2 copper base layer are pressed to form an integrated copper base plate, a concentric cover film layer is attached to the copper base plate, and a heat dissipation groove is formed in one side of the G1 copper base layer. The problem of
high heat dissipation of part of special high-frequency carrier products is reduced or solved, the problem of concentricity of multiple
layers of high-frequency covering films is solved, the problems of hole plugging and
solder mask blistering and
cracking in multiple
layers of thick copper holes are solved, and the method has market prospects and is suitable for popularization.