High-heat-dissipation multilayer high-frequency copper-based microwave signal plate and preparation process thereof

Abstract

The invention discloses a high-heat-dissipation multilayer high-frequency copper-based microwave signal board and a preparation technology thereof, and belongs to the field of PBC multilayer high-frequency metal substrates, the high-heat-dissipation multilayer high-frequency copper-based microwave signal board comprises a copper base material and a plurality of circuit layers, the copper base material comprises a G1 copper base layer and a G2 copper base layer, and the G1 copper base layer and the G2 copper base layer are arranged on the PCB multilayer high-frequency metal substrate. A heat dissipation groove and a first heat dissipation hole are formed in one side of the G1 copper base layer, a second heat dissipation hole is formed in the G2 copper base layer, the multi-layer circuit layer comprises an L1 circuit core, an L2 circuit layer core, an L3 circuit layer core and an L4 outer layer wire core, the multi-layer circuit layer, the G1 copper base layer and the G2 copper base layer are pressed to form an integrated copper base plate, a concentric cover film layer is attached to the copper base plate, and a heat dissipation groove is formed in one side of the G1 copper base layer. The problem of high heat dissipation of part of special high-frequency carrier products is reduced or solved, the problem of concentricity of multiple layers of high-frequency covering films is solved, the problems of hole plugging and solder mask blistering and cracking in multiple layers of thick copper holes are solved, and the method has market prospects and is suitable for popularization.

Description

technical field [0001] The invention relates to the field of PBC multilayer high-frequency metal substrates, and more specifically relates to a multilayer high-frequency copper-based microwave signal board with high heat dissipation and a preparation process thereof. Background technique [0002] With the popularization and wide application of electronic products, the production and manufacturing technology of circuit boards are also constantly developed and updated. In order to meet the needs of different types of electronic products, research and development innovations such as design and manufacturing, product structure, material application, process methods, and equipment improvement; high frequency Microwave signal, fast information transmission, good confidentiality, large amount of information, wide frequency bandwidth and other advantages make electronic products more reliable and more powerful, making high frequency widely used in the field of information industry; h...

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Problems solved by technology

[0009] Aiming at the problems existing in the prior art, the purpose of the present invention is to provide a multilayer high-frequency copper-based microwave signal board with high heat dissipation and its preparation process, which can reduce or solve the high heat dissipation problem of some special high-frequency carrier products, and solve many The concentricity problem of the high-frequency covering film of the first layer solves the problem of hole plugging in multi-layer thick copper holes and anti-soldering blistering and cracking

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