The invention discloses an LED vacuum packaging process, which comprises the steps of (1) carrying out
die bonding on a substrate; (2) pressing the edge of a fluorescent soft film on the substrate ina vacuum environment, wherein the part, which is positioned on the inner side of the pressed edge, of the fluorescent soft film is not pressed, and a
wafer mounting area is formed between the substrate and the fluorescent soft film; and (3) unloading vacuum. By adopting the technical scheme, the substrate after
die bonding is put into a vacuum pressing device for vacuum pressing of the fluorescentsoft film, only the periphery of the fluorescent soft film is in press fit with the substrate, and the
wafer mounting area at the middle position forms a vacuum cavity, so that after the substrate ismoved out of the vacuum cavity, the fluorescent soft film is tightly pressed on the
wafer and the substrate under the action of
external pressure, the fluorescent film uniformly covers the surface ofthe wafer, the appearance consistency is good, the excitation light color is more uniform, the original
coating and dispensing processes are also omitted, and the production efficiency is greatly improved. In addition, the invention further provides a corresponding vacuum pressing device.