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LED vacuum packaging process and vacuum pressing device

A technology of vacuum packaging and vacuum pressing

Active Publication Date: 2020-09-08
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the traditional LED packaging technology, the process of die-bonding-coating-dispensing is adopted, which has many procedures and relatively low production efficiency, and there may be uneven distribution of fluorescent film on the surface of the wafer, which affects the luminous effect. Therefore, it is necessary to Improve

Method used

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  • LED vacuum packaging process and vacuum pressing device
  • LED vacuum packaging process and vacuum pressing device
  • LED vacuum packaging process and vacuum pressing device

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Embodiment Construction

[0025] The present invention will be described below in conjunction with the accompanying drawings and specific embodiments.

[0026] Such as figure 1 , 2 , 3, and 5, a vacuum packaging process for LEDs, comprising the following steps:

[0027] (1) Die bonding on the substrate 1, and the chip 2 is flipped on the substrate 1;

[0028] (2) Press the edge of the fluorescent soft film 3 on the substrate 1 in a vacuum environment, and the inner part of the fluorescent soft film 3 located at the pressed edge is not pressed, and the chip mounting area 4 is formed between the substrate 1 and the fluorescent soft film 3 ;

[0029] (3) Unload the vacuum;

[0030] (4) Baking and curing the fluorescent soft film 3;

[0031] (5) Segmentation and cutting of the substrate 1 to form a single packaged LED 5 .

[0032] Such as Figure 4 As shown, the structure of the vacuum pressing device used in the above step (2) is as follows: the vacuum pressing device includes a vacuum chamber 6, an...

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Abstract

The invention discloses an LED vacuum packaging process, which comprises the steps of (1) carrying out die bonding on a substrate; (2) pressing the edge of a fluorescent soft film on the substrate ina vacuum environment, wherein the part, which is positioned on the inner side of the pressed edge, of the fluorescent soft film is not pressed, and a wafer mounting area is formed between the substrate and the fluorescent soft film; and (3) unloading vacuum. By adopting the technical scheme, the substrate after die bonding is put into a vacuum pressing device for vacuum pressing of the fluorescentsoft film, only the periphery of the fluorescent soft film is in press fit with the substrate, and the wafer mounting area at the middle position forms a vacuum cavity, so that after the substrate ismoved out of the vacuum cavity, the fluorescent soft film is tightly pressed on the wafer and the substrate under the action of external pressure, the fluorescent film uniformly covers the surface ofthe wafer, the appearance consistency is good, the excitation light color is more uniform, the original coating and dispensing processes are also omitted, and the production efficiency is greatly improved. In addition, the invention further provides a corresponding vacuum pressing device.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED vacuum packaging process and a vacuum pressing device. Background technique [0002] In the traditional LED packaging technology, the process of die-bonding-coating-dispensing is adopted, which has many procedures and relatively low production efficiency, and there may be uneven distribution of fluorescent film on the surface of the wafer, which affects the luminous effect. Therefore, it is necessary to Improve. Contents of the invention [0003] The object of the invention is to provide a LED vacuum packaging process with high production efficiency and uniform distribution of fluorescent films. To achieve the above object, the present invention adopts the following technical solutions: [0004] A LED vacuum packaging process, comprising the following steps: [0005] (1) Die bonding on the substrate; [0006] (2) Press the edge of the fluorescent soft film on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L25/075
CPCH01L25/0753H01L33/48H01L33/505H01L2933/0033H01L2933/0041
Inventor 赵明深
Owner HONGLI ZHIHUI GRP CO LTD
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