The invention provides an organometallic complex, containing
oxygen free organic ligands, for the deposition of a
metal, preferably
copper, silver or gold, and preferably by way of
chemical vapor deposition. The organometallic complex having the formula [(Do)nMLx]k where M is a
metal preferably selected from the group consisting of Cu, Ag and Au; Do is selected from the group comprising ethers, phosphines, olefins, sulfides, pyridines, carbonyl, hydroxyl,
cyclopentadiene,
benzene derivatives, allyls, alkyls, amines, polyamines,
aniline derivatives,
cyclooctadiene and combinations thereof; n is an integer having a value from 0 to 4; k is an integer having a value from 1 to 4; x is an integer having a value from 1 to 4; and L is an amidinate ligand of the formula R1—NC(R2)N—R3 where R1, R2 and R3 are selected from the group consisting of alkyls, allyls, aryls, heteroaryls,
hydrogen, non-metals and metalloids; and where R1, R2 and R3 are different or the same.