The invention discloses a non-interlayer discontinuous pressure adding and vacuum
diffusion bonding technology for
copper and aluminum
alloy. The technology comprises the steps of putting
copper and aluminum or aluminum
alloy test panels ready to be welded in a
vacuum chamber of a vacuum
diffusion welding device, controlling vacuum degree of the
vacuum chamber to be 10 <-4> -10 <-5> Pa, starting a heating procedure, controlling rate of temperature raising to be 5-15 DEG C / min, arranging heat preservation platforms at the temperature of 330-350 DEG C and 520-530 DEG C respectively during the temperature-raising process, wherein the time for heat preservation is 5-10 min; then starting a pressure adding procedure to conduct discontinuous pressure adding, continuing raising the temperature to 570-595 DEG C, conducting heat preservation for 40-60 min, and completing the
diffusion bonding. According to the non-interlayer discontinuous pressure adding vacuum
diffusion bonding technology for the
copper and aluminum
alloy, under the condition that no interlayer is added, a pattern of discontinuous pressure adding is adopted, an
intermetallic compound formed on a diffusion interface of the copper and the aluminum at a high temperature is then broken and dissolved, structure properties of a joint are then improved, and diffusion combination of heterogeneous metals -copper and aluminum- is thus achieved.