A deposition apparatus and method for continuously depositing a
polycrystalline material such as polysilicon or polycrystalline SiGe layer on a mobile discrete or continuous web substrate. The apparatus includes a pay-out unit for dispensing a discrete or continuous web substrate and a deposition unit that receives the discrete or continuous web substrate and deposits a series of one or more thin film
layers thereon in a series of one or more deposition or
processing chambers. In a preferred embodiment, polysilicon is formed by first depositing a layer of amorphous or
microcrystalline silicon using PECVD and transforming said layer to polysilicon through heating or annealing with one or more lasers, lamps, furnaces or other heat sources.
Laser annealing utilizing a pulsed
excimer is a preferred embodiment. By controlling the
processing temperature, temperature distribution within a layer of amorphous or
microcrystalline silicon etc., the instant deposition apparatus affords control over the grain size of polysilicon.
Passivation of polysilicon occur through treatment with a
hydrogen plasma.
Layers of polycrystalline SiGe may similarly be formed. The instant deposition apparatus provides for the continuous deposition of electronic devices and structures that include a layer of a
polycrystalline material such as polysilicon and / or polycrystalline SiGe. Representative devices include photovoltaic devices and thin film transistors. The instant deposition apparatus also provides for the continuous deposition of
chalcogenide switching or memory materials alone or in combination with other
metal, insulating, and / or semiconducting
layers.