The invention discloses a flip LED
chip array structure. The flip LED
chip array structure comprises a transparent substrate made of a transparent material; a buffer layer arranged on one surface of the transparent substrate; an N-type
semiconductor structural layer and a P-type
semiconductor structural layer formed on the buffer layer; a current
diffusion layer made of a conductive material; a
passivation layer arranged above the P-type
semiconductor structural layer, made of a transparent insulating material, and covering the current
diffusion layer, the P-type semiconductor structural layer, and the N-type semiconductor structural layer; a plurality of N-type
electrode window regions arranged in an array manner and contacted with the N-type semiconductor structural layer; and P-type
electrode window regions contacted with the P-type semiconductor structural layer. The N-type
electrode window regions are provided with N-type electrodes, the P-type electrode window regions are provided with P-type electrodes, and the heights of the P-type electrodes and the N-type electrodes are the same. According to the flip LED
chip array structure, the effective light-emitting area of the high-power LED chip is increased, the effective contact area between the chip electrodes and the heat
radiation substrate is increased, the heat
radiation effect is better, and the service lifetime of the chip is prolonged.