Spliced board process side and board splicing method

Abstract

The invention discloses a spliced board process side and a board splicing method. The spliced board process side is arranged at the periphery of the pattern units of a circuit board. The spliced boardprocess side comprises at least two layers of laminated process sides. Each layer of process side is provided with balance copper points, and the residual copper rate of each layer of process side isthe same with the residual copper rate of the pattern units of the corresponding layer. The spliced board of the board splicing method comprises the spliced board process side and the pattern units and test strips or test modules which are arranged in the spliced board process side. According to the spliced board process side, the residual copper rate of each layer is the same with the residual copper rate of the pattern units of the corresponding layer so that the consistency of the dielectric layer thickness of the spliced board process side and the pattern units after lamination and glue filling can be guaranteed, the board thickness consistency of the spliced board can be enhanced, the current density distribution of the spliced board process side and the pattern units in electroplating is ensured to be more uniform, the accuracy of the test result of the test strips or the test modules arranged in the process side can be enhanced and the relevant real value of the pattern units can be effectively represented.

Description

technical field [0001] The present invention relates to the field of electronics, and more specifically, to a jigsaw process edge and a jigsaw method. Background technique [0002] The uniformity of the thickness of the PCB dielectric layer has a certain impact on the performance of the PCB. For example, as the PCB tends to be thinner and shorter, the thickness of the dielectric layer in the PCB is getting smaller and smaller, so that the control of the uniformity of the dielectric layer thickness has a great impact on the impedance. The impact is growing. For PCBs with impedance control requirements, the current common practice is to design impedance test strips or test modules at the edge of the PCB panel to simulate the impedance in the unit. The impedance of the impedance test strips or test modules can be detected quickly and conveniently. To accurately judge the impedance control of the PCB. However, due to the large differences between the graphics of the impedance ...

AI Technical Summary

Problems solved by technology

[0004] Based on this, the present invention is to overcome the defects in the prior art that the thickness of the PCB intermediary layer is uneven due to the design of the PCB, which further leads to the fact that the detection results of the test strip or the test module cannot truly reflect the corresponding value of the graphic unit, and provides a collage process Edge and Jigsaw Method

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