560results about How to "Suppress failure" patented technology

An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes an insulating base, a semiconductor circuit device, chip parts, a molding resin, an antenna conductor, a ground conductor, and external lead electrodes. The plurality of chip parts are mounted on the insulating base, and are soldered to electrodes of wiring conductors on the top of the insulating base for electric and physical connection. The insulating base has a multilayer structure, being formed by laminating a plurality of insulator layers. The antenna conductor is formed on the bottom of the insulating base. A wiring conductor adjacent to the antenna conductor is provided with the ground conductor so that it overlaps with the antenna conductor.

An evaporation apparatus with high utilization efficiency for EL materials and excellent film uniformity is provided. The invention is an evaporation apparatus having a movable evaporation source and a substrate rotating unit, in which the space between an evaporation source holder and a workpiece (substrate) is narrowed to 30 cm or below, preferably 20 cm, more preferably 5 to 15 cm, to improve the utilization efficiency for EL materials. In evaporation, the evaporation source holder is moved in the X-direction or the Y-direction, and the workpiece (substrate) is rotated for deposition. Therefore, film uniformity is improved.

A semiconductor device and method of manufacturing the same, a circuit board and an electronic instrument are such that without substrate material selection or additional steps after connection, connection reliability can be assured, while direct connection to a substrate is possible, further allowing an electronic instrument to be made more compact and lightweight. The semiconductor device comprises a semiconductor chip (100) having electrodes (104), an interconnect layer (120) connected to the electrodes (104), a conducting layer (122) provided on the interconnect layer (120) avoiding the area of the electrodes (104), an underlying metal layer (124) having a size larger than the peripheral outline of the conducting layer (122) provided on the conducting layer (122) and easier to be deformed than the conducting layer (122), bumps (200) provided on the underlying metal layer (124), and a resin layer (126) provided on the periphery of the conducting layer (122).

The present invention observes the status on the server side from the storage device side, and controls the processing priority in accordance with the server status. The storage device 2 is utilized by numerous servers 1A through 1C. The server 1A and server 1B form a failover cluster. The status detection part 5 judges whether or not an event observed from the server 1A or 1B corresponds to a specified event (link down or the like). In cases where such a specified event is observed, the status detection part 5 detects the occurrence of failover. In accordance with the detection of the occurrence of failover, the priority control part 6 sets the processing priority of the failover destination server at a priority that is higher than the ordinary processing priority. When the preset failover time has elapsed, the priority during failover is returned to the ordinary priority.

The present invention provides a display device substrate, a display device substrate manufacturing method, a display device, a liquid crystal display device, a liquid crystal display device manufacturing method and an organic electroluminescent display device that allow suppressing faults derived from occurrence of gas and/or bubbles in a pixel region. The present invention is a display device substrate that comprises: a photosensitive resin film; and a pixel electrode, in this order, from a side of an insulating substrate. The display device substrate has a gas-barrier insulating film, at a layer higher than the photosensitive resin film, for preventing advance of a gas generated from the photosensitive resin film, or has a gas-barrier insulating film, between the photosensitive resin film and the pixel electrode, for preventing advance of gas generated from the photosensitive resin film.

A liquid crystal panel 1 has a configuration in which an element substrate 10 including routing wiring 16 and a counter substrate 20 including scanning lines 25 are adhered with a sealing material 30 therebetween and, in addition, a liquid crystal is injected between both substrates through a liquid crystal injection hole 30a formed in the sealing material 30. The scanning lines 25 are brought into conduction with the routing wiring 16 through conducting particles 32 dispersed in the sealing material 30. However, the scanning lines 25, which have end portions reaching the neighborhood of the liquid crystal injection hole 30a, among the plurality of scanning lines 25, are brought into conduction with the routing wiring 16 through conducting particles 32 dispersed in a vertical conduction portion 37 or through the conducting particles 32 in both the sealing material 30 and the vertical conduction portion 37.

The generation of residues or flakes of a color filter is suppressed to eliminate conduction failures on an LCD substrate having a color filter on an array substrate. A passivation film formed between a pixel electrode formed in each of a plurality of pixel regions and a TFT for driving the pixel electrode has a multi-layer structure constituted by SiN layers and a SiO layers, and the SiO layer is located at the top of the film. A resin CF layer is formed on the passivation film having such a multi-layer structure. Since the resin CF layer is formed directly on the SiO layer, reduction of the adhesion of the same is suppressed. As a result, the color filter is unlikely to come off when the resin CF layer is formed, and residues of the color filter is unlikely to be generated when a contact hole is formed in the resin CF layer. This suppresses conduction failures and makes it possible to provide a reliable TFT substrate and LCD having high display characteristics.

A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

A thin film transistor allowed to suppress a failure caused by an interlayer insulating film and improve reliability of a self-alignment structure, and a display device including this thin film transistor are provided. The thin film transistor includes: a gate electrode; an oxide semiconductor film having a channel region facing the gate electrode, and having a source region on one side of the channel region, and a drain region on the other side of the channel region; an interlayer insulating film provided in contact with the oxide semiconductor film as well as having a connection hole, and including an organic resin film; and a source electrode and a drain electrode connected to the source region and the drain region, respectively, via the connection hole.

A touch screen panel and a display device having the same are capable of improving visibility and suppressing the occurrence of a failure caused by static electricity. In one embodiment, the touch screen panel includes a plurality of first sensing cells arranged along a first direction for each column on a transparent substrate. A first connection pattern electrically connects adjacent first sensing cells to each other. A plurality of second sensing cells are arranged along a second direction for each row while being spaced apart from the first sensing cells. A second connection pattern electrically connects adjacent second sensing cells to each other. In the touch screen panel, the first connection pattern comprises a pair of metal patterns and two pairs of dummy transparent patterns.

Connectable, multimedia and multiservice mobile assembly for diagnosis and medical checkups, characterized in that it is composed of a directional rolling base (2) and of a cylindrical hollow body (3) enclosing electrical power supply means (28, 29), identification means (18), computing means and multimedia communication means as well as a facility (39) for disinfecting the hands and in that it is predisposed for its reception and connection to a docking station. This invention is of particular interest to manufacturers of trolleys intended for hospitals and care units.

An exposure apparatus that exposes a substrate includes: an optical system that includes an emission surface from which an exposure light is emitted; a first surface that is disposed in at least a part of a surrounding of an optical path of the exposure light emitted from the emission surface; a second surface that is disposed in at least a part of a surrounding of the first surface and at a position lower than the first surface; a space portion into which a liquid can flow via a first aperture between the first surface and the second surface and which is opened to the atmosphere via a second aperture different from the first aperture; and a first recovery portion that recovers at least a part of the liquid flowing into the space portion. Here, the emission surface, the first surface, and the second surface are opposed to the surface of the substrate in at least a part of the exposure of the substrate, and the substrate is exposed with the exposure light from the emission surface via the liquid between the emission surface and the surface of the substrate.

A flexible printed circuit board of the present invention directly relays connecting portions of a magnetic head placed on a suspension to connecting portions of a base end of a carriage arm in a head suspension assembly of a magnetic disk apparatus. The flexible printed circuit board includes a laminate composed of at least a base layer, a plurality of conductive circuits formed on the base layer, a cover layer covering the conductive circuits, and a conductive polymer layer formed in the insulating material portion in the surface of the laminate. The flexible printed circuit board includes a stainless layer below the base layer or on a lower side of the conductive polymer layer on the base layer side. More preferably, in the magnetic head connecting portion, the cover layer is not formed, and on the base layer in the magnetic head connecting portion, a conductive polymer layer is formed, whereas on the plurality of conductive circuits in the magnetic head connecting portion, the conductive polymer layer is not present or is substantially absent, if any, to such a degree as to allow the magnetic head to be electrically connected to the conductive circuits.

A gate driver (24) which is provided by an IGZO-GDM and a level shifter circuit (13) are connected to each other via a first through a fifth wires (OL1 through OL5). Each wire (OL) is connected to a discharge unit (190). If an electric power supply to a first through a fifth output circuits (OC1 through OC5) in the level shifter circuit (13) becomes lower than a lower operation limit value during a power-off sequence which is supposed to remove a residual charge from inside a panel, outputs from the first through the fifth output circuits (OC1 through OC5) assume a high-impedance state, whereupon a potential on each wire (OL) is drawn by a discharge unit (190) into a ground potential. Therefore, residual charge inside the panel is removed quickly and stably when power supply is shut off.

The RFID tag includes: a main unit consisting of a base, a communication antenna that is wired on the base, a circuit chip that is electrically connected to the antenna and performs radio communication via the antenna, a chip reinforcing member covering the periphery of the circuit chip, an underside reinforcing member that is disposed at a position that sandwiches the base with respect to the chip reinforcing member, and a rubber cover member that covers these components; and protective layers that sandwich the main unit from the front and rear sides and have greater slipperiness than the slipperiness between the main unit and a contactant.

A dielectric ceramic including a perovskite compound represented by the general formula {(Ba_1-x-yCa_xSn_y)_m(Ti_1-zZr_z)O₃} as a primary component in which the x, y, z, and m satisfy 0.02≦x≦0.20, 0.02≦y≦0.20, 0≦z≦0.05, and 0.99≦m≦1.1 and is processed by a thermal treatment at a low oxygen partial pressure of 1.0×10⁻¹⁰ to 1.0×10⁻¹² MPa. Accordingly, there are provided a dielectric ceramic which can be stably used in a high-temperature atmosphere without degrading dielectric properties, properties of which can be easily adjusted, and which generates no electrode breakage even when ceramic layers and conductive films are co-fired, and a ceramic electronic element, such as a multilayer ceramic capacitor, which uses the above dielectric ceramic.