133results about How to "Reduced package area" patented technology

The invention relates to an MEMS sensor encapsulation structure and an encapsulation method thereof, which are used for encapsulating an MEMS sensor. The MEMS sensor encapsulation structure is characterized by comprising a ceramic base, a side wall and a top cap, wherein a plurality of metal bonding pads are respectively arranged on a top layer and a bottom layer of the ceramic base; the metal bonding pads on the top layer of the ceramic base are connected with leads of the MEMS sensor; the MEMS sensor is arranged on the ceramic base; the metal bonding pads on the bottom layer of the ceramic base are connected with an external circuit; the ceramic base adopts one-layer or multi-layer perpendicularly interconnected structure; the side wall and the top cap are both made of kovar alloy. According to the invention, the ceramic base of which coefficient of thermal expansion is approximate to that of the MEMS sensor material is selected as the encapsulation material, in order to reduce influence of the base expansion stress to the MEMS sensor; meanwhile, the ceramic base can be utilized to realize one-layer perpendicular interconnection or multi-layer perpendicular interconnection; the system-level integration between the MEMS sensor and the peripheral circuit can be realized within a small area; high-density system-level encapsulation can be realized; the encapsulation flexibility and the expansibility of the MEMS sensor can be realized.

The invention discloses a super-high-density LED display device which comprises a substrate and an LED chip array packaged on the substrate. The chip array comprises a plurality of LED chips distributed evenly at intervals. By means of the Fan-Out Wafer-Level Package (FOWLP) process, the packaging area is narrowed, and the resolution ratio of an LED display screen is increased; all the LED chips are the same in structure, light-emitting wave band and type, the LED chips emit red light, green light and blue light after being coated with red light fluorescent powder, green light fluorescent powder and blue light fluorescent powder in a chip light-emitting curing mode respectively, and therefore it is ensured that the LED chips are consistent in light attenuation in the use process, and the development performance of the display screen is improved; pixel point distances can be smaller than 1 mm and even smaller than 0.1 mm, better performance such as high integrity, high resolution and consistent light color of the LED display device is achieved, and the super-high-density LED display device is importantly applied to indoor high-density display screens, projection devices and wearable display devices.

The invention discloses a low temperature co-fired ceramic-based micro-electromechanical system (MEMS) packaging method. The method comprises the following steps of: preparing an upper low temperature co-fired ceramic substrate and a lower low temperature co-fired ceramic substrate respectively and forming a three-dimensional electrically-interconnected network, an embedded micro-channel and an open cavity in the upper substrate and/or the lower substrate; aligning the upper substrate with the lower substrate for packaging, packaging components and parts in the cavity and communicating the micro-channel with the cavity and the outside of a packaged body; and connecting an external micro-tube to the outlet of the micro-channel, which leads to the outside of the package body, and realizing gas or liquid flow between the cavity and the outside through the external micro-tube. The method has the advantages of improving the integration level, the stability and the flexibility of MEMS packaging, realizing vacuum packaging and heat dissipation of the components and parts in the cavity by conveying a circulating radiating medium through the micro-channel and conveying detection samples and the like to medical, biological or chemical MEMS components and parts in the packaging cavity through the micro-channel.

The invention discloses a color-temperature-adjustable COB packaging structure and a packaging method thereof. The color-temperature-adjustable COB packaging structure comprises a packaging substrate, CSP chip scale packaging devices, LED chips and a florescent glue sealing layer. The CSP chip scale packaging devices and the LED chips are fixed on the packaging substrate and wrapped by the florescent glue sealing layer. The florescent glue sealing layer is internally provided with at least one CSP chip scale packaging device and the LED chip, wherein the CSP chip scale packaging devices comprise chips and florescent glue wrapping the chips. The florescent glue and the florescent glue sealing layer are different in phosphor concentration. Light emitted by the CSP chip scale packaging devices and the LED chips passes through different numbers of phosphor powder particles and then color of different color temperature is obtained. The effect of color temperature adjustment can be achieved by controlling driving current in the CSP chip scale packaging devices and the LED chips.

An image sensor package structure is proposed, in which an image sensor is fixed on a substrate having metallization traces and an adhesion layer. Electric paths of the package structure are changed from the COG (chip on glass) process to the CIS (CMOS image sensor) process to improve electric characteristics. Moreover, spacers are formed at appropriate positions to prevent glue overflow from contaminating the sensing regions and solder balls. The proposed package structure can also shrink the package area to greatly enhance the yield and quality.

The invention relates to a package of light-sensitive element and relative production. Wherein, it comprises: mounting light-sensitive chip on the base plate; clearing the contaminant; then using adhesive to mount a transparent sealing cover with chamber above the base plate, to cover the chip; therefore, it can clear the contaminant, improve the yield and reduce the packing area; in addition, the invention can arrange connecting part above the base plate and sealing cover to support connection.

The invention discloses a circuit module and a manufacturing method thereof. The circuit module comprises a printed circuit board, a package chip and a switch tube, wherein the package chip and the switch tube are arranged on the printed circuit board, the package chip comprises a chip, a first plastic package layer and a plurality of metal posts, the first plastic package layer covers the chip, each metal post comprises a first end and a second which are opposite to each other, the first end is in contact with the chip, and the second end is exposed out of the first plastic package layer. Thepackage chip in the circuit module employs the metal posts to external electrical connection, so that the package area is reduced, and the reliability is improved.

The invention discloses a reading circuit of a non-refrigeration infrared focal plane detector and a method for improving the yield. An effective element circuit array is subjected to row gating and column integration through a control module, and a substitute signal is obtained according to the fault signal of the effective element circuit. Effective element resistors and fault effective elementresistors of adjacent rows are connected in parallel, so that the fault effective element circuit works normally, and the image elements of infrared images can be restored in real time. Further, a substitute signal is obtained according to the fault signal of a blind element or a reference element circuit, the adjacent blind element or reference element resistor and fault blind element or reference element resistor are connected in parallel, so as to restore the blind element circuit or reference element circuit. The problem of damaged column line or damaged row line of an infrared focal planeis solved.