Semiconductor package stack with through-via connection

Abstract

A package stack includes at least two packages stacked on each other. Each package has a substrate, a circuit pattern positioned on the substrate, a semiconductor chip attached to the substrate, and a number of through-vias formed on a lateral surface. A number of electrical connection members are attached to the through-vias so as to electrically connect the packages to each other. The through-vias are vertically positioned on the lateral or side surface of the packages. And a solder ball is attached to the lower surface of the substrate of the lowest package.

Description

technical field [0001] The present invention relates to semiconductor packages, and in particular to semiconductor package stacks connected using through-holes. Background technique [0002] Due to the rapid progress of semiconductor integrated circuit packaging technology, packaging technology with smaller volume and higher reliability is also required. With the rapid advancement of chip-scale packaging technology, the size of some semiconductor packages has shrunk to about the size of a general semiconductor chip. Improving semiconductor packaging process efficiency is therefore as important as ensuring post-package mechanical and electrical reliability. [0003] With the requirement of miniaturization and high performance, someone proposed the concept of stacking technology. The term "stacking" generally refers to vertically overlapping at least two semiconductor chips or packages. For example, two 256MDRAMs are stacked to form a 512M DRAM. Stacked packages can provid...

AI Technical Summary

Problems solved by technology

[0008] However, according to this conventional package stack, at least two PCBs 22, 24 and connection walls 26 are required between the package stacks for electrical connection, thus increasing manufacturing cost and defect rate

[0009] In addition, the basic structure of traditional package stacks is to stack two packages together, thus limiting its miniaturization

[0010] Moreover, the connection walls such as 26 connecting the PCBs 22, 24 also require space, so it is not easy to reduce the overall size and packaging area.

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