The invention discloses a correction mechanism on silicon wafer etching equipment, and relates to the technical field of silicon wafer production equipment. The correction mechanism comprises a base,a supporting seat, a conveying roller, a driving device, a conveying belt, a slide holder, a sliding seat, a correction mechanism and a guide wheel. The passive part of the correction mechanism is pushed by the trigger plate of the slide holder; a first gear with the diameter smaller than that of a rotating column is driven to rotate under transmission teeth on the rotating column (according to the transmission ratio principle in a mechanical transmission system, the rotating angle of the first gear equivalent to a small gear is larger than that of the rotating column equivalent to a large gear); the guide wheel is driven by the rotating part connected with the first gear to move in the arc direction from front to back along the arc end face of the silicon wafer, and front-back and left-right position correction of the silicon wafer is achieved. Besides, a second gear rotates along connecting teeth under the rotation of the rotating part, so that the guide wheel is driven to rotate. The static friction between the guide wheel and the silicon wafer is changed into dynamic friction, and the abrasion damage of the guide wheel to the silicon wafer is greatly reduced.