The invention provides a fan-out type packaging structure and a fan-out type packaging method, and relates to the technical field of semiconductors. The structure comprises a packaging element, a
plastic packaging body, a first
dielectric layer and a second
dielectric layer, the packaging element is provided with a first bonding pad and a second bonding pad, the first bonding pad is lower than the second bonding pad, the
plastic packaging body packages the packaging element in a plastic mode, the end face of the first bonding pad is exposed out of the surface of the
plastic packaging body, and the end face of the second bonding pad is exposed out of the surface of the plastic packaging body. A first wiring layer is arranged on one side, far away from the packaging element, of the first bonding pad, and a first
welding ball is arranged on the first wiring layer; the first
dielectric layer is arranged on the side, away from the packaging element, of the first wiring layer, the end face of the second bonding pad is exposed out of the surface of the first
dielectric layer, a second wiring layer is arranged on the side, away from the packaging element, of the second bonding pad, and second
welding balls are arranged on the second wiring layer; a second
dielectric layer is arranged on the side, away from the first wiring layer, of the second wiring layer. The structure can reduce the number of wiring
layers and does not need to additionally increase conductive columns.