Semiconductor bipolar light emitting and laser devices and methods
A technology of semiconductors and laser pulses, applied in the direction of lasers, laser components, phonon exciters, etc.
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[0060] Figure 1 illustrates the device set forth in the mentioned PCT publication WO 2005 / 020287. The substrate 105 has the following layers disposed thereon: a sub-collector 110, a collector, a base 140, an emitter 150, and a cap layer 160. The collector metal (or electrode) 115, the base metal 145, and the emitter metal 165 are also shown. The collector lead 117, the base lead 147, and the emitter lead 167 are also shown. As disclosed in the mentioned co-pending application, the collector layer 130 includes 3000 angstroms thick n-type GaAs, n=2×10 16 cm -3 , The base layer 140 includes 600 angstroms thick p+ carbon doped InGaAs (1.4% In) graded in composition, p=4.5×10 19 cm -3 , The emitter layer 150 includes 800 angstroms thick n-type InGaP, n=5×10 17 cm -3 , And the cap layer includes 1000 angstroms thick n+InGaAs, n=3×10 19 cm -3 .
[0061] As disclosed in the mentioned PCT publication WO 2005 / 020287, for the traditional PN junction diode operation, the recombination process...
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