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Connector structure and method of making the same

A manufacturing method and connector technology, applied in the direction of connection, fixed connection, electrical connection of printed components, etc., can solve problems affecting signal transmission performance and achieve the effect of reducing capacitance effect

Active Publication Date: 2018-07-13
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the connector structure 50 transmits signals through the terminals 58, the two conductor layers will generate a capacitive effect at the dielectric layer 57, thereby affecting the performance of signal transmission

Method used

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  • Connector structure and method of making the same
  • Connector structure and method of making the same
  • Connector structure and method of making the same

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Embodiment Construction

[0035] figure 2 It is a flow chart of making the connector structure of the embodiment of the present invention. Figure 3A to Figure 3D yes figure 2 Schematic cross-sectional illustration of the fabrication method of the connector structure. Please refer to figure 2 , in this embodiment, the manufacturing method of the connector structure 100 includes the following steps: In step S110 , a substrate 110 is provided. In step S120 , at least one dielectric layer 120 is laminated on the surface of the substrate 110 . In step S130 , a via hole 112 is formed, and the via hole 112 penetrates through the substrate 110 and the dielectric layer 120 . In step S140 , at least one terminal 130 is pressed on the dielectric layer 120 , and the terminal 130 is pressed on a side of the dielectric layer 120 that is locally adjacent to the through hole 112 . In step S150 , a conductive layer 140 is formed on the surface of the terminal 130 not in contact with the dielectric layer 120 an...

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Abstract

The invention discloses a connector structure and a manufacturing method thereof. The manufacturing method includes the following steps. Substrate is provided. At least one dielectric layer is pressed onto the surface of the substrate. A through hole is formed, and the through hole penetrates the substrate and the dielectric layer. At least one terminal is pressed onto the dielectric layer, and the terminal is pressed onto a side of the dielectric layer adjacent to the through hole. A conductive layer is formed on the surface of the terminal that is not in contact with the dielectric layer and in the through hole to electrically connect the terminal and the through hole and form a conductive through hole. A connector structure manufactured by the above manufacturing method is also disclosed.

Description

technical field [0001] The present invention relates to a connector structure, and more particularly, the present invention relates to a manufacturing method of the connector structure. Background technique [0002] In recent years, in order to increase the application of circuit boards, various types of connectors are manufactured on the circuit boards, so that the electronic devices equipped with the circuit boards have more application functions. Among them, some connectors can be directly fabricated on the circuit board during the production process of the circuit board. [0003] figure 1 is a schematic diagram of a known connector structure. Please refer to figure 1 , the manufacturing method of the connector structure 50 is to provide the substrate 52, and form a through hole on the substrate 52, and plate the upper and lower surfaces of the through hole and the part of the through hole on the substrate 52 to form a circuit layer 54 on the upper and lower surfaces o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/40
CPCH01R12/51H01R43/00H05K1/116H05K1/119H05K2201/0394
Inventor 范智朋谢清河苏铃凯郑尹华
Owner UNIMICRON TECH CORP
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