119results about How to "Reduce area ratio" patented technology

Disclosed is an in-plane switching (IPS) mode liquid crystal display (LCD) device having an increased aperture ratio by overlapping a storage capacitor on a lower end of an electrode. The (IPS) mode liquid crystal display device (LCD) device includes first and second substrates; a gate line and a data line arranged horizontally and vertically to define a plurality of pixel regions on the first substrate; a switching device, having a gate electrode, a semiconductor layer and source and drain electrodes, at a crossing of the gate line and the data line; a passivation film on an entire surface of the first substrate including the switching device; a common electrode and a pixel electrode alternately disposed at an upper portion of the passivation film and generating an in-plane electric field, wherein at least one of the common and pixel electrodes has a first storage capacitor at its lower end; and a liquid crystal layer between the first and second substrates.

An aluminum electric wire with crimp-type terminal includes a coated electric wire including a conductor having a plurality of twisted aluminum element wires made of an aluminum alloy, a conductor portion where the plurality of aluminum element wires exposed by stripping an insulating coating of the coated electric wire are integrally formed into a solid wire, a crimp-type terminal made of a copper alloy having a conductor crimping portion crimped to couple to the conductor portion formed into the solid wire, and a water-repellent agent provided for a front side exposed conductor portion and a rear side exposed conductor portion 49 exposed to outside air without being covered by the conductor crimping portion of the crimp-type terminal.

There is provided an organic electroluminescence type two-dimensional color image display panel includes multiple arrayed pixels, the pixels being each formed by arranging organic EL devices having at least red, green, and blue luminescent colors in a certain order, in which each of the organic EL devices has a pair of two parallel sides in a planar shape, the organic EL devices having luminescent colors different from each other are adjacent to each other at the two parallel sides, and the organic EL devices having the same luminescent color are adjacent to each other in a parallel line direction of the two parallel sides, and are arrayed to be of shape of stripes arranged parallel to each other while being slanted with respect to a vertical line.

A capacitive touch sensing assembly is a plate body assembled by a first and second substrate glued by a gluing layer. The first and second substrates are insulated transparent thin plates, and the gluing layer is an insulated transparent adhesive. On an upper surface of the first substrate, a capacitive sensing layer including a plurality of transparent first and second axis traces intersecting to each other. Induction-spots formed on each first axis trace are connected one by one, and induction-spots formed on each second axis trace are formed separately with gaps. An inducting layer has a plurality of conducting wires formed along the direction of the second axis traces. Electrical joints formed on two ends of the conducting wires contact the two adjacent induction-spots of the second axis traces respectively so as to electrically connect all induction-spots on each second axis trace.

The present invention provides an organic EL light-emitting apparatus that can compensate a voltage drop caused on a transparent electrode and that can prevent the occurrence of brightness unevenness caused by the voltage drop.A transparent electrode 2, an organic light-emitting functional layer 5, and a back electrode 6 are successively laminated on a light-transmitting substrate 1, and a sealing member 9 for sealing the transparent electrode, the organic light-emitting functional layer, and the back electrode is provided so as to accommodate them between the substrate 1 and the sealing member 9. A conductive layer 10 is formed on the sealing member 9, and conductive columnar members 4 are interspersedly formed between the conductive layer 10 and the transparent electrode 2 in the plane direction of the substrate 1. Accordingly, electric power is supplied to the transparent electrode 2 from the conductive layer 10 through the conductive columnar members 4.

In a disposable pull-on wearing article, sheet strips carrying thereon display elements are bonded to an inner surface of an elastically stretchable outer sheet of the article. An inner sheet facing inner surfaces of the sheet strips and being elastically stretchable is bonded to the outer sheet intermittently in a waist-surrounding direction as well as in a vertical direction orthogonal to the waist-surrounding direction in a region extending from lateral edges of sheet strips to spots at which front and rear waist regions of the article are bonded to each other along transversely opposite side margins of the waist regions.

There is provided an organic electroluminescence type two-dimensional color image display panel includes multiple arrayed pixels, the pixels being each formed by arranging organic EL devices having at least red, green, and blue luminescent colors in a certain order, in which each of the organic EL devices has a pair of two parallel sides in a planar shape, the organic EL devices having luminescent colors different from each other are adjacent to each other at the two parallel sides, and the organic EL devices having the same luminescent color are adjacent to each other in a parallel line direction of the two parallel sides, and are arrayed to be of shape of stripes arranged parallel to each other while being slanted with respect to a vertical line.

An n− drift layer is a parallel pn layer having an n-type region and a p-type region are alternately arranged in the direction parallel to the main surface so as to come into contact with each other, and have a width in a direction parallel to the main surface of the substrate which is less than a length in a direction perpendicular to the main surface of the substrate. A second-main-surface-side lower end portion of the p-type region has a structure in which a high-concentration lower end portion and a low-concentration lower end portion of a p-type low-concentration region are repeated at a predetermined pitch in the direction parallel to the main surface of the substrate. It is possible to provide a super junction MOS semiconductor device which can improve a trade-off relationship between turn-off loss and turn-off dv / dt and improve avalanche resistance.

The invention discloses a direct type backlight module and a display terminal. The backlight module comprises a lamp panel and a rear panel, wherein LED (Light Emitting Diode) lamps, which are distributed in an array, are arranged on a first surface of the lamp panel; cabling terminals and / or lamp panel driving modules of the LED lamps are arranged on a second surface of the lamp panel; the LED lamps are electrically connected with the cabling terminals and the lamp board driving modules; the cabling terminals are used for outward electric connection; the rear panel is located at the side of the second surface of the lamp panel; the rear panel is provided with an avoiding structure; the cabling terminals and the lamp panel driving modules are located in the avoiding structure. According tothe direct type backlight module disclosed by the invention, the cabling terminals and the lamp panel driving modules are arranged on one surface of the lamp panel and are stored in the avoiding structure of the rear panel, so that the LED lamps and the cabling terminals and / or the lamp panel driving modules are integrated and the area ratio of a function panel on the rear panel is reduced so that the appearance region of the rear panel is enlarged; the rear panel can be used as a rear shell, so that the thickness of the backlight module is greatly reduced and a television is thinned.

A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, comprising a laser beam application step of applying a laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers having a predetermined depth from the back surface of the wafer; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the deteriorated layers formed therein; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the deteriorated layers; and a grinding step of grinding the back surface of the wafer divided along the deteriorated layers in a state of the protective sheet being affixed to the wafer, to remove the deteriorated layers.

Here is disclosed a disposable pull-on wearing article. In the article, sheet strips carrying thereon display elements are bonded to an inner surface of an elastically stretchable outer sheet of the article. An inner sheet facing inner surfaces of the sheet strips and being elastically stretchable is bonded to the outer sheet intermittently in a waist-surrounding direction as well as in a vertical direction orthogonal to the waist-surrounding direction in a region extending from lateral edges of sheet strips to spots at which front and rear waist regions of the article are bonded to each other along transversely opposite side margins of the waist regions.

An optical gain-fiber of a fiber-laser or a fiber-amplifier is optically pumped by radiation from a plurality of external cavity, optically pumped, surface-emitting semiconductor lasers (OPS-lasers). In one example, radiation from the OPS-lasers is focused by a lens into cladding of the gain-fiber at one end of the fiber. In another example radiation from the diode-lasers is focused into the core of a delivery fiber at one end of the delivery fiber. The other end of the delivery fiber is coupled to the cladding of the gain-fiber.

The invention provides a liquid cooling radiator, and the liquid cooling radiator comprises a water inlet, a water outlet, a radiator cover plate, a radiator main body and a water cooling flow channel. The water cooling flow channel is arranged on a heat dissipation face of the radiator body and is of a groove structure. The radiator cover plate is connected with a radiating surface of the radiator main body, and a heat conducting surface of the radiator main body is connected with a heating chip. The water cooling flow channel comprises a first flow channel and a second flow channel. A cooling fin area is arranged at a position, corresponding to the heating chip, of the second flow channel, and the cooling fin area comprises a plurality of cooling fins arranged according to a preset rule.The corresponding cooling fin area is arranged according to the distribution position of the heating chip, so that the area proportion of the cooling fin area in the water cooling flow channel is reduced, the flow velocity is reduced to reduce the flow resistance, the heat dissipation efficiency is improved, and the processing and manufacturing difficulty and cost of the liquid cooling radiator are reduced.

The invention provides an OLED pixel and a display panel using the same. The OLED pixel comprises three sub-pixel groups. Each sub-pixel group comprises a first sub-pixel and a second sub-pixel, wherein the first sub-pixel and the second sub-pixel share one driving circuit, and the light emitting waveband of the first sub-pixel and the light emitting waveband of the second sub-pixel are complementary. The sum of the light emitting wavebands of the first sub-pixels of the sub-pixel groups is a white light waveband. According to the OLED pixel and the display panel using the same, the sub-pixels are formed by means of the principle of diffraction of light and the combination of white light OLED light emitting bodies, beam splitting pieces and light barriers. Due to the fact that the six kinds of sub-pixels all adopt the white light OLED light emitting bodies, the problem of chromatic aberration caused by different aging degrees of different materials is avoided. Due to the fact that three kinds of sub-pixels are additionally arranged to assist imaging processing, luminous efficiency of the OLED pixel is improved and power consumption is reduced. Due to the fact that the two sub-pixels of each sub-pixel group share one driving circuit, the distinguishability of the OLED display panel is improved.

A capacitive touch sensing assembly is a plate body assembled by a first and second substrate glued by a gluing layer. The first and second substrates are insulated transparent thin plates, and the gluing layer is an insulated transparent adhesive. On an upper surface of the first substrate, a capacitive sensing layer including a plurality of transparent first and second axis traces intersecting to each other. Induction-spots formed on each first axis trace are connected one by one, and induction-spots formed on each second axis trace are formed separately with gaps. An inducting layer has a plurality of conducting wires formed along the direction of the second axis traces. Electrical joints formed on two ends of the conducting wires contact the two adjacent induction-spots of the second axis traces respectively so as to electrically connect all induction-spots on each second axis trace.

There is provided a single-layer capacitive touch sensor including a plurality of sensing units arranged in a matrix on a substrate. Each of the sensing units has a Out electrode, a second electrode and a third electrode. The second electrode is arranged in a ring shape and electrically isolated from the first electrode, and the first electrode is located in an interior space of the ring shape. The third electrode is arranged outside of the interior space and electrically connected to the first electrode, wherein the second electrode of at least a part of the sensing units is configured to respectively form a mutual capacitance with the third electrode of two adjacent sensing units.

The invention relates to a sapphire-substrate single-electrode LED chip structure and a preparation method thereof. The sapphire-substrate single-electrode LED chip structure comprises a sapphire substrate. Epitaxial structural layers are grown on the sapphire substrate. The epitaxial structural layers include a U-GaN layer, an N-GaN layer, an MQW layer and a P-GaN layer. The MQW layer and a P-GaN layer are partially etched, and the N-GaN layer is exposed. An ITO layer is arranged on the P-GaN layer. A positive electrode is arranged on the ITO layer. The sapphire-substrate single-electrode LED chip structure is characterized in that negative electrodes are arranged on the side surfaces of the sapphire substrate, the negative electrodes are arranged in a skewed slot of one side surface or skewed slots of a plurality of side surfaces or side edges, and metal 1-5 [mu]m in thickness covers side walls of the skewed slots to form the negative electrodes. According to the invention, the area ratio of the electrodes is greatly lowered, and the light extraction rate of the chip is effectively improved.

A thermal head has heating elements that can be selectively driven independently from one another during a driving operation to directly heat, and thereby thermally activate, regions of a heat-sensitive adhesive layer of a heat-sensitive adhesive sheet while the heat-sensitive adhesive sheet is moved relative to the thermal head with the heating elements disposed in opposing relation to the respective regions of the heat-sensitive adhesive layer. All but at least one of the heating elements are selectively driven so that (a) a preselected region of the heat-sensitive adhesive layer disposed in opposing relation to each non-driven heating element is not directly heated, and thereby not directly thermally activated, by the non-driven heating element, (b) the regions of the heat-sensitive adhesive layer disposed in opposing relation to the respective driven heating elements are directly heated, and thereby directly thermally activated, by the respective driven heating elements, and (c) each preselected region of the heat-sensitive adhesive layer opposed to a non-driven heating element is thermally activated with heat transmitted from surrounding directly heated regions of the heat-sensitive adhesive layer of the heat-sensitive adhesive sheet.

The rocket motor nozzle assembly of this invention includes a throat insert and a carbon or silica protective eyelid. The throat insert has a carbon throat support and a refractory metal shell. The shell is positioned radially inside the throat support to cover the inner surface of the throat support. The protective eyelid covers a sufficient portion of the forward surface region of the shell and the underlying converging portion of the throat support to protect these components against particle impingement. The protective eyelid extends sufficiently far forward along the converging / diverging pathway to cover and protect the forward face or edge of the throat insert and prevent the combustion gases from passing under the throat insert and reaching the radially outer surfaces of the throat insert. However, the protective eyelid leaves the throat surface region of the shell exposed to the converging / diverging pathway.

The invention relates to a bearing strip used for packing chips and a chip packing structure, wherein a plurality of sharing testing pads are arranged in a testing pad area of two packing areas on the bearing strip, which are simultaneously electrically connected with the two packing areas, which reduces the area of the testing pad on the bearing strip, reduces cutting waste, and can save repeated acting time of electrical testing devices in electrical testing, thereby improving testing efficiency.

The present disclosure relates to a thin film transistor substrate for flat panel display including an organic light emitting diode display. The present disclosure provides a device comprising: a substrate; a scan line extending in a first direction on the substrate; a buffer layer on the scan line; a semiconductor layer extending in a second direction and crossing the scan line on the buffer layer; a gate insulating layer on the semiconductor layer; a gate electrode connected to the scan line, and extending in the first direction and crossing the semiconductor layer on the gate insulating layer; an intermediate insulating layer on the gate electrode; a data line crossing the scan line on the intermediate insulating layer; a source electrode branching from the data line and contacting a first side of the semiconductor layer; and a drain electrode facing the source electrode and contacting a second side of the semiconductor layer.

The invention discloses a display panel and a display device. The display panel comprises a display area including a light-emitting area and a non-light-emitting area. An array layer includes a substrate layer and a plurality of metal lines arranged in the non-light-emitting area. The display layer is arranged above the array layer and consists of a plurality of light-emitting devices including anodes, light-emitting layers and cathodes. A support structure is formed between each two adjacent light-emitting devices in one non-light-emitting area. A fingerprint recognition area is arranged in the display area and includes a plurality of light-sensitive devices arranged at the side, away from the display layer, of the array layer. The support layers include first support structures arrangedin the fingerprint recognition area; the orthographic projection of the first support structures on the substrate layer are first projections; orthographic projections of the metal lines on the substrate layers are second projections; and the overlap areas of the first projections and the second projections are not less than 80% of the first projection area. Therefore, the light amount that is needed by fingerprint recognition and is received by the light-sensitive devices is increased and the accuracy of fingerprint recognition is improved.

A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of applying a laser beam to the wafer along the dividing lines from the side of the back surface thereof to form grooves having a predetermined depth in the back surface; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the grooves in the back surface; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the grooves; and a grinding step of grinding the back surface of the wafer divided along the grooves in a state of the protective sheet being affixed to the wafer, to remove the grooves.

An organic light emitting diode (OLED) display according to an exemplary embodiment includes: a display substrate; an organic light emitting element on the substrate; a sealing member covering the organic light emitting element; a sealant formed between a surrounding portion of the display substrate and a surrounding portion of the sealing member; and an impact absorption layer under the display substrate, wherein an area ratio of the impact absorption agent in the impact absorption layer increases from the surrounding portion of the display substrate to a center of the display substrate such that the impact absorption ratio of the outer portion of the surrounding impact absorption layer is higher than the impact absorption ratio of the center impact absorption layer, and accordingly, damage to the surrounding portion of the display substrate that is weak against external impact may be prevented.

A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of applying a laser beam to the wafer along the dividing lines from the side of back surface thereof to form grooves having a predetermined depth in the back surface; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the grooves in the back surface; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the grooves; and a grinding step of grinding the back surface of the wafer divided along the grooves in a state of the protective sheet being affixed to the wafer, to remove the grooves.

The invention concerns a skin preparation for moistening human skin comprising a combination of a component A and a component B, wherein A includes at lest two saturated C9-C31 fatty acids selected from the group consisting of iso- and anteiso fatty acids, whereby component B consists of cholesterol in an amount of 5-15% by weight of component A.