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Liquid cooling radiator

A technology of radiator and radiator cover, which is applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc. Poor cooling effect, etc.

Active Publication Date: 2019-07-05
HYCET TRANSMISSION SYST (JIANGSU) CO LTD BAODING RES & DEV BRANCH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention aims to propose a liquid-cooled radiator to solve the problem of the large flow resistance of the water-cooled liquid in the liquid-cooled radiator in the prior art, the poor heat dissipation effect, and the difficulty in processing and manufacturing the liquid-cooled radiator. problems with cost increases

Method used

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  • Liquid cooling radiator
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Embodiment Construction

[0040] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0041] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0042] Such as figure 1 As shown, it shows an axial perspective view of a liquid cooling radiator provided by an embodiment of the present invention, the liquid cooling radiator includes: a water inlet 10, a water outlet 20, a radiator cover 30, and a radiator main body 40 and water-cooling runner 50; water-cooling runner 50 is arranged on the heat dissipation surface of radiator main body 40, and water-cooling runner 50 is a groove structure; radiator cover plate 30 is connected with the heat dissipation surface of radiator main body 40, further reference figure 2 , which shows a schematic diagram of the appearance of a liquid-cooled radiator provided by an embodiment of the present i...

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Abstract

The invention provides a liquid cooling radiator, and the liquid cooling radiator comprises a water inlet, a water outlet, a radiator cover plate, a radiator main body and a water cooling flow channel. The water cooling flow channel is arranged on a heat dissipation face of the radiator body and is of a groove structure. The radiator cover plate is connected with a radiating surface of the radiator main body, and a heat conducting surface of the radiator main body is connected with a heating chip. The water cooling flow channel comprises a first flow channel and a second flow channel. A cooling fin area is arranged at a position, corresponding to the heating chip, of the second flow channel, and the cooling fin area comprises a plurality of cooling fins arranged according to a preset rule.The corresponding cooling fin area is arranged according to the distribution position of the heating chip, so that the area proportion of the cooling fin area in the water cooling flow channel is reduced, the flow velocity is reduced to reduce the flow resistance, the heat dissipation efficiency is improved, and the processing and manufacturing difficulty and cost of the liquid cooling radiator are reduced.

Description

technical field [0001] The invention relates to the field of liquid cooling and heat dissipation, in particular to a liquid cooling radiator. Background technique [0002] The drive motors of new energy vehicles are developing in the direction of high power. With the increase of the total power, the heating and heat dissipation problems of the power chips in the motor controller will become more and more serious, which requires the use of high-performance liquid cooling radiators to ensure timely heat dissipation of the chips and prevent reliability problems caused by excessive chip temperatures . [0003] For the current liquid-cooled radiator, multiple U-shaped heat dissipation channels are arranged on the inner surface of the liquid-cooled radiator. The U-shaped heat dissipation channels are set in series or in parallel, and through multiple The spoiler protrusions cover the entire surface of the U-shaped heat dissipation channel. The spoiler protrusions are usually cyl...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20872H05K7/20927
Inventor 刘笑天
Owner HYCET TRANSMISSION SYST (JIANGSU) CO LTD BAODING RES & DEV BRANCH
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