60results about How to "Meet the requirements of the working environment" patented technology

The invention relates to a bag collating and clamping linkage mechanism for three-dimensional packaging bags. The bag collating and clamping linkage mechanism comprises a framework. A cylinder is arranged on the upper portion of the framework, perpendicular linear guide rails are respectively arranged on two sides of the framework, and two driving rods are respectively slidably connected onto the two perpendicular linear guide rails, are in drive connection with a bag clamping mechanism arranged on the framework and are connected with each other by a transverse rod; a lifting frame with a single shifting fork is arranged in the middle of the front of the framework, a lifting frame with double shifting forks is arranged in the middle of the rear of the framework, the lower portion of the lifting frame with the single shifting fork and the lower portion of the lifting frame with the double shifting forks are connected with the upper portion of the transverse rod in an abutted manner, the upper portion of the lifting frame with the single shifting fork and the upper portion of the lifting frame with the double shifting forks are respectively connected with compression springs arranged at the front and the rear of the framework, and the lifting frame with the single shifting fork and the lifting frame with the double shifting forks are jointly in drive connection with a bag collating mechanism arranged on the framework. The bag collating and clamping linkage mechanism has the advantages that power can be saved, a mechanism linkage effect can be realized, the bag collating and clamping linkage mechanism is compact in structure, the packaging speed can be greatly increased, and the production efficiency can be improved.

The invention discloses a ceramic packaging base. This ceramic package base includes an insulating base and a tungsten conductive layer; the tungsten conductive layer is disposed on at least one surface of the insulating base; the insulating base is formed of aluminum nitride ceramics; wherein, the tungsten conductive layer includes W, Al and M, where M represents rare earth elements. The aluminum nitride ceramic package base prepared by the invention has high thermal conductivity, good bonding force of the conductive layer and low wiring resistance. This aluminum nitride ceramic package base is suitable for the sensor field, especially the high-power TOF module package, which not only solves the problem of heat dissipation, but also meets the requirements of the TOF working environment.