44results about How to "Meet the isolation requirements" patented technology

The invention discloses a full-duplex active phased filter antenna array surface, and aims at providing an antenna array surface with high-isolation array transmitting and receiving and good filter characteristic. A transmitting antenna array surface of a transmitting array antenna and a receiving antenna array surface of a receiving array antenna consist of a plurality of arrayed radiation units;a multi-layer printed board integrally integrating a radiation circuit, a feed switching circuit and a filter circuit achieves connection between different circuits by vertical interconnection structures of metallized via holes; a metal upper cavity body of a transmitting-receiving component serves as a metal ground; a metal upper cavity body base of a metal floor is consubstantially connected byradio-frequency fuzz button connectors; and then a radiation unit and transmitting-receiving component integrated box-type submatrix module filter antenna unit is formed. With the adoption of the full-duplex active phased filter antenna array surface, high-isolation array transmitting and receiving can be achieved; insertion losses of array transmitting and receiving can be reduced; and high-precision amplitude and phase control can be achieved.

Provided is a sliding seismic isolation platform which can isolate external disturbance and prevent an exhibited valuable article from being toppled and damaged. When the bottom of the sliding seismic isolation platform suffers from impact of horizontal external force, an article stage can freely reciprocate along X-direction arc-shaped rails and Y-direction arc-shaped rails, external impact is isolated, and the article placed on the article stage remains stable. After the external force disappears, the article stage can return to the initial position under the action of self-gravity. Movement damping of the sliding seismic isolation platform can be adjusted continuously, and therefore a system seismic isolation period is controlled, and the applicable range of the seismic isolation platform is widened.

The invention relates to a fiber and polytetrafluoroethylene plate rubber combined shock insulation support, and belongs to the field of shock insulation for room buildings. The support mainly comprises rubber layers, fiber layers and polytetrafluoroethylene plates which are staggered and laminated according to a sequence of a first rubber layer, one of the polytetrafluoroethylene plates, a second rubber layer, one of the fiber layers and a third rubber layer; a plurality of layers are laminated, and the rubber layer is arranged on the top, so that a laminated body is formed; end steel plates are respectively arranged on the upper end face and the lower end face of the laminated body, and a rubber protection layer is arranged around the lateral direction of the laminated body; and the final support is formed by vulcanization and bonding. The support is light in weight and low in assembly cost; and the vertical rigidity and the bearing capacity of the support can be changed by adjusting the number of polytetrafluoroethylene plates in the support.

The invention discloses an isolated BUCK-BOOST circuit and a control method thereof. The circuit includes a phase-shifted full-bridge transform unit with transformer isolation, a switch tube, a rectifying tube, a first inductor and an output capacitor; in the two output ends of the phase-shifted full-bridge transform unit, one is connected to one end of the first inductor, and the other one and one end of the switch tube are connected to one end of the output capacitor; the other end of the first inductor and the other end of the switch tube are connected to one end of the rectifying tube, andthe other end of the rectifying tube is connected to the other end of the output capacitor; the input end of the phase-shifted full-bridge transform unit is taken as the input voltage end of the isolated BUCK-BOOST circuit; and the output capacitor is taken as the output voltage end of the isolated BUCK-BOOST circuit. The isolated BUCK-BOOST circuit can suitable for wide input voltage ranges andmeet electrical isolation requirements.

The invention provides a waveband-tunable broadband optical isolator, and belongs to the technical field of optics. The waveband-tunable broadband optical isolator is formed by sequentially arranging a first collimator, a first analyzing crystal, a tunable half-wave plate assembly, a tunable magneto-optic crystal assembly, a second analyzing crystal and a second collimator in the optical path transmission direction. The first analyzing crystal, the second analyzing crystal, the tunable half-wave plate assembly and the tunable magneto-optic crystal assembly are arranged in an outer seal piece. The first collimator and the second collimator extend into the two ends of the outer seal piece respectively. The tunable half-wave plate assembly includes at least two half-wave plates with different working wavebands. The tunable magneto-optic crystal assembly includes a magnetic ring and a movable magneto-optic crystal sleeved with the magnetic ring. By the cooperation between the waveband-tunable half-wave plate assembly and the movable magneto-optic crystal, high-isolation and low-loss transmission of light of different wavebands is achieved, transmission of forward light is guaranteed, the optimal isolation requirement of reverse light is met, and long-term and stable work of a tunable laser system is ensured.

The embodiment of the invention relates to a power amplifier packaging device and base station equipment. The power amplifier packaging device comprises a shell and power amplifier pipes, wherein the power amplifiers are arranged in the shell and placed in parallel corresponding to radio frequency channels, and isolation plates used for absorbing interference electric magnetic waves sent by the power amplifier pipes is arranged between the power amplifier pipes. The base station equipment comprises a plurality of radio frequency channels, a sending antenna and the power amplifier packaging device. According to the power amplifier packaging device and the base station equipment, materials capable of absorbing interference electric magnetic waves sent by the power amplifier pipes are made into the isolation plates of the power amplifier packaging device, an electric magnetic band gap structure and the shell and are used for absorbing the interference electric magnetic waves generated among the power amplifier pipes, thus the power amplifier pipes corresponding to the radio frequency channels are placed in a package, the requirement on isolation among the power amplifier pipes is met, and the invention has the advantages of simple manufacture process, small volume and low cost.

The invention relates to a dual-frequency antenna structure for a 5G metal frame mobile phone terminal. The antenna structure comprises a metal frame and a metal front shell disposed in the metal frame. The side of the metal frame, corresponding to the metal front shell, is provided with an insulating bracket. The metal front shell is provided with a mainboard. The side of the mainboard, oppositeto the metal front shell, is covered with a copper layer. The mainboard is provided with a plurality of antenna units on the copper layer side. Each antenna unit includes a feed port and a feeder line. One end of the feed port is connected to the mainboard, and the other end is connected to the feeder line. The feeder line is an L-shaped structure, and the feeder line is mounted on the insulatingbracket. The metal front shell is provided with a first gap matched with the antenna unit. The first gap is parallel to the feeder line. The metal frame is provided with a second gap which is used foradjusting resonance length of the antenna unit to quarter wavelength. The dual-frequency antenna structure achieves purposes of miniaturization, dual frequency band and high isolation of an antenna,and provides a feasible technical scheme for design of a MIMO antenna of a 5G metal frame mobile phone terminal.

The invention provides a protecting and isolating device and an IGBT power module. The protecting and isolating device comprises a first group of isolating plates and a second group of isolating plates. The first group of isolating plates comprises supporting plates and insulating plates. The second group of isolating plates also comprises supporting plates and insulating plates. The supporting plates and the insulating plates are of long-strip U-shaped trough plate structures. The insulating plates are attached to the inner sides of U-shaped grooves of the supporting plates. Installation foot plates connected with an installation face of a water cooling substrate of the IGBT power module are arranged at the lower portions of the supporting plates. According to the protecting and isolating device and the IGBT power module, the IGBT power module is separated from the outside through the first group of isolating plates and the second group of isolating plates. The first group of isolating plates and the second group of the isolating plates are of the structures with the supporting plates and the insulating plates combined, so that the electric isolation requirement is met and the mechanical strength can be improved. Furthermore, the supporting plates and the insulating plates are easy to process, and the processing difficulty and the processing cost can be reduced.

The invention relates to the technical field of civil engineering, in particular to a shock isolation support with a servo shock isolation system. The shock isolation support with the servo shock isolation system comprises a laminated rubber support, wherein a support protective sleeve is arranged on the outer surface of the laminated rubber support in a sleeving manner; an upper flange plate is connected to the upper end of the laminated rubber support through connecting bolts, and a lower flange plate is connected to the lower end of the laminated rubber support through connecting bolts; an upper cover plate is fixedly connected to the upper surface of the upper flange plate; and a servo control system for enabling the shock isolation support with the servo shock isolation system to perform adaptive adjustment is mounted on the lower flange plate. The shock isolation support with the servo shock isolation system disclosed by the invention is simple in structure; a feedback control technology is introduced, so that the driving optimal feedback control of the shock isolation system is realized; the shock isolation support has an adaptive adjustment mechanism, so that different control targets can be realized; and the shock isolation support has an effective frequency bandwidth and an advantage of being not liable to resonate with a control structure, the mechanical stability and the electromechanical performance stability of the system can be realized, and the shock insulation requirements of engineering structures having special shock insulation requirements, mechanical equipment, valuable articles and the like can be met by the shock isolation support.

The invention discloses a quartering microstrip power divider. The quartering microstrip power divider comprises a shell (1), a signal input and output port group (2) and a power divider assembly (3), wherein the power divider assembly (3) adopts a multi-branch snakelike structure to output power distribution signals and has a plurality of power dividers in topological connection. On the basis of Wilkinson power divider topology, five-branch snakelike routing is adopted to broaden the frequency band, so that the frequency band is expanded to DC-6G; the length of each branch is reduced to be smaller than lambda / 4, and the coupling distance of each branch is shortened as far as possible to reduce the size; through measures of adjusting characteristic impedance of each branch and the like, microstrip isolation is improved, the size and performance of the coupler are enabled to be optimal, and the requirement of miniaturization design and the requirement of isolation are met. The invention aims at solving the technical problem that the miniaturization requirement of a traditional Wilkinson power divider is not enough in the using environment with higher space requirement in the prior art.

The invention discloses an inclined silicon groove etching process. The process includes steps: forming a hard mask layer on the surface of a to-be-etched wafer, coating the surface of the hard mask layer with photoresist, and performing exposure and development to expose a to-be-etched hard mask layer window; performing hard mask etching at the exposed window, and etching to the surface of the wafer; performing silicon groove etching at the window subjected to hard mask etching, and etching to a set value of silicon groove depth, wherein etching gas is SF6, passivation gas comprises O2 and Hbr, bias power is 50-55W, bias power efficiency is 110-130Hz, bias power cycle is 65%-75%, and source radio-frequency power is 1000-1100W; removing photoresist in a non-silicon-groove area according toa dry-process photoresist removal method. A silicon groove side wall angle is optimized from 90 degrees to be close to 80 degrees; in a subsequent silicon groove filling process, voids formed after filling are eliminated, and accordingly breakdown voltage is increased, electric leakage is reduced, and reliability of a dielectric isolation integrated process is improved.

The invention provides a transmission method and communication equipment, and the communication equipment comprises a first port, a second port, a third port, at least one branching unit, and SUL receiving equipment which is used for supporting an SUL function. The first port is connected with a multi-channel antenna supporting multiple frequency bands and the at least one branching unit; the second port is connected with a first RRU of the first network and the at least one branching unit, the third port is connected with a second BBU of a second network and the SUL receiving device, the at least one demultiplexer is connected with the SUL receiving device, and communication protocols of the first network and the second network are different. According to the scheme, by means of the communication equipment, when SUL receiving equipment and RRUs supporting different network frequency bands are deployed at the same station, shunt transmission of uplink signals of multiple frequency bands can be achieved, interference caused by stray downlink signals in a network can be filtered out, and therefore the isolation degree requirement is met.

The present application relates to an isolated communication circuit, comprising a circuit board and an isolated communication device disposed on the circuit board; the isolated communication device comprises a primary port, an isolation chip, and a secondary port that are sequentially connected; the primary port is used for connecting a primary device; the secondary port is used for connecting asecondary device, wherein the region between a primary pin and a secondary pin of the isolation chip on the circuit board is a prohibited wiring region; the isolation chip is coated with an insulatingprotective layer; and the insulating protective layer is used for making the creepage distance of the isolation chip greater than or equal to a required creepage distance of the secondary device. Theisolated communication circuit of the present application reduces the possibility that the overvoltage is transmitted to the secondary device along the surface of the isolation chip and the circuit board, thereby realizing voltage isolation of the primary device and the secondary device; the isolation requirement for the secondary device in a high altitude environment can be met, and high-speed,low-power, and wall-to-wall communication between the primary and secondary devices is achieved.

The invention provides an antenna feeder which is arranged on plane horizontal tails and is connected with a radio altimeter. The antenna feeder comprises a receiving microstrip antenna, a transmitting microstrip antenna, a receiving feeder and a transmitting feeder. The receiving microstrip antenna and the transmitting microstrip antenna are located in horizontal tails on both sides of a verticalstabilizer respectively. The receiving feeder is connected with the receiving microstrip antenna and the radio altimeter. The transmitting feeder is connected with the transmitting microstrip antennaand the radio altimeter. The receiving feeder and the transmitting feeder are crossed to come into the fuselage from the horizontal tails.

The invention discloses an adjustable optical receiver applied to TWDM-PON system and an adjustable filter thereof; the adjustable optical receiver applied to TWDM-PON system comprises an incident collimating device, an F-P cavity filtering standard tool, a drive device and an APD chip packaged in the box body, the F-P cavity filtering standard tool is combined by two or more than two F-P cavity filtering standard tools having the same free space spectrum width; the optical signal enters into the F-P cavity filtering standard tool through the incident collimating device, the drive device adjusts the work wavelength of each F-P cavity filtering standard tool for reaching the agreement and adjusts the wavelength from the F-P cavity filtering standard tool to the TWDM-PON downlink signal for filtering, the APD chip is arranged at the receiving end of the F-P cavity filtering standard tool for converting the filtered optical signal into the electrical signal; for the application of the TWDM-PON, the industrialization is easily formed, the volume is small and the cost is lower.

The invention relates to the technical field of antennas, and discloses a multi-antenna layout structure of an antenna bracket, and a mobile terminal. According to the multi-antenna layout structure,a plurality of feed branches arranged at intervals are coupled around a common coupling branch on an antenna bracket, one feed branch is provided with at least one feed end, the feed end is used for being electrically connected with a radio frequency port of a mobile terminal, and a 1 / 4 wavelength impedance converter is also electrically connected between the two feed ends electrically connected with the two radio frequency ports in the same frequency band. According to the invention, a plurality of feed branches are coupled at the same time through a common coupling branch, so that multi-antenna layout is realized in a limited space; and two radio frequency ports in the same frequency band are connected with corresponding feed ends through a 1 / 4 wavelength impedance converter to form an isolation network, so that mutual interference between two radio frequency ports working in the same frequency band can be greatly reduced, and the isolation requirement between antennas is met.

Embodiments of the present invention provide an attendance check base station, an attendance check method, and a system. The attendance base station includes: a short-distance communication protocol module, a WiFi module and a control module, the transmission distance of the short-distance communication protocol module is less than the transmission distance of the WiFi module; the short-distance communication protocol module is connected with one end of the control module, and the short-distance communication protocol module It includes a short-distance communication protocol chip and a short-distance communication protocol antenna; the WiFi module is connected to the other end of the control module, and the WiFi module includes a WiFi chip, a built-in antenna of the WiFi module with the same working frequency band, and an external antenna of the WiFi module; When the working frequency band of the communication protocol module is the same as that of the WiFi module, control the WiFi chip to switch to the external antenna of the WiFi module. The embodiment of the present invention realizes the coexistence of the WiFi module and the short-distance communication protocol module, so that the attendance base station not only has the traditional wireless function, but also has the attendance and positioning functions, simplifies the deployment scheme of the attendance system, and saves the attendance cost.

The invention provides a semiconductor device fixing structure. The semiconductor device fixing structure comprises a substrate, a heat dissipation plate, a mainboard, an insulating spacer and a metal elastic piece, wherein the heat dissipation plate is arranged on the substrate; the mainboard is arranged on the heat dissipation plate, the mainboard extends towards the outer side of the heat dissipation plate, and a semiconductor device is arranged on the mainboard; the insulating spacer is arranged on the heat dissipation plate, and the semiconductor device is coated with the insulating spacer; and a first part of the metal elastic piece is arranged on the insulating spacer, the first part is used for extruding the insulating spacer, a second part of the metal elastic sheet is fixed on the heat dissipation plate or the substrate, and the first part and the second part are arranged at an angle. The semiconductor device fixing structure provided by the invention is simple in structure.

The invention relates to the technical field of optical relays, and further discloses a high-isolation-voltage and high-current optical relay with a self-recovery function. The optical relay comprisesa shell body, a circuit mainboard, an input wafer, an output wafer, a control wafer, a light emitting diode, a sampling resistor and pins, wherein the circuit mainboard is arranged in the shell body;the input wafer is fixedly arranged on the surface of the circuit mainboard; the output wafer is fixedly arranged on the surface of the circuit mainboard; the control wafer is fixedly arranged on thesurface of the circuit mainboard; the light emitting diode is fixedly arranged on the surface of the circuit mainboard; the sampling resistor is fixedly arranged on the surface of the circuit mainboard; the pins are fixedly arranged on the side walls of the circuit mainboard; and the ends, away from the circuit mainboard, of the pins extend out of the shell body. The high-isolation-voltage and high-current optical relay with the self-recovery function has the advantages of automatically recovering high isolation voltage and high current, meets the isolation requirement of 4000 Vrms, is realized by a 10 A load optical relay, and has the functions of channel state feedback, overcurrent protection and self-recovery at the same time.

The invention provides a structure and a method for improving MIMO system antenna isolation. The structure comprises an isolation unit and two etching grooves, wherein the isolation unit is arranged on a metal antenna bottom plate and located between two antennas, and the distance between the two antennas is larger than half of the working wavelength of the antennas; the two etching grooves are located in the two sides of the isolation unit; and the isolation unit is of a double-arm inverted-L-shaped structure composed of two L-shaped arms. The structure and the method can be applied to improvement of the isolation degree of the existing indoor and outdoor small base station omnidirectional antenna, have the replicability and are simple and rapid in design, the isolation is obviously improved, and compared with neutral line decoupling and resonator decoupling, additional matching design does not need to be carried out on an input port, the design flexibility is higher, and compared with metamaterial decoupling, the design is simpler, the cost is lower, and the structural compatibility is higher.

The invention relates to a complementary metal oxide semiconductor (CMOS) active region isolating process. The process comprises the following steps: a, providing a first conductive type substrate, and forming a second conductive type well region; b, arranging a first barrier layer and a second barrier layer on the first conductive type substrate in sequence; c, coating a photoresist, and removing the photoresist on the field; d, removing the second barrier layer and first barrier layer on the field; e, etching the field to form an isolation trench; f, arranging a first side wall layer and a second side wall layer; g, removing the corresponding second side wall layer on the active region and at the bottom of the isolation trench, and forming a correspondingly distributed side wall in the isolation trench; h, oxidizing on the field to form an isolation layer; i, removing the corresponding first side wall layer and second barrier layer on the active region, and removing the side wall which is on the first conductive type substrate and is corresponding to the field; and j, removing the first barrier layer on the first conductive type substrate. The process is easy to operate, and the beak is reduced, so the isolation requirement of a deep sub-micron CMOS process is met.

The invention discloses a gain-adjustable anti-interference broadband receiver which comprises an automatic gain adjusting mode and a manual gain adjusting mode. Automatic control of a main control module on a numerical control attenuator and a variable gain amplifier is the automatic gain adjusting process of the receiver. The manual adjustment of the digital control attenuator and the variable gain amplifier by the external control module is the process of manually adjusting the gain of the receiver, and the size of the gain of the whole receiver is adjustable through independent automatic adjustment of the gain, or independent manual adjustment of the gain, or the matching of the automatic adjustment of the gain and the manual adjustment of the gain. When in use, gain adjustment can be carried out according to actual requirements, and the receiver has the characteristics of adjustable gain, interference resistance and large dynamic range, and can meet the requirements of performance indexes of the receiver in a complex electromagnetic environment.

The disclosed isolated amplifier in use for parallel optical fiber communication system includes following parts and structures: at least two amplifiers are setup at P type substrate; N type regions in quantity of number equal to corresponding number of amplifier are set up at P type substrate; setting up P trap inside N type region, and setting up high adulterated P region inside P trap; through contact hole, the high adulterated P region is connected to metal inner ring, and amplifier is positioned at inner region enclosed by metal inner ring; setting up high adulterated N region at N region outside P trap, and through contact hole, the high adulterated N region is connected to metal outer ring. Features are: simple designed CMOS technique, and satisfied isolation between amplifiers.

The invention discloses a UV radio frequency (RF) switch network with low insertion losses and high isolation. The UV RF switch network comprises n input switch paths and m output switch paths, wherein each input switch path is connected in series with all the output switch paths to form a network structure, so that n x m switch paths are formed; the UV RF switch network is packaged in an enclosed cavity formed by a substrate and cover plates; a plurality of separated partition cavities are formed in the cavity through partition plates; each input switch path and each output switch path are respectively arranged in two of the partition cavities; RF signals between the partition cavities corresponding to the input switch paths and the partition cavities corresponding to the output switch paths are connected through RF cables; and the cover plates are respectively arranged on the two sides of the substrate, so that the enclosed cavity with an upper layer and a lower layer is formed. The UV RF switch network has the characteristics of small size and high isolation, and can not only meet the isolation requirements but also achieve the minimum insertion losses.

The invention provides a method and a device for combining adjacent channel systems, relates to the field of communication, and aims to enable an isolation bandwidth between the adjacent channel systems to meet an inter-system isolation requirement and realize combination of the adjacent channel systems. The method comprises the following steps: determining a minimum isolation bandwidth needed by combination of a first communication system and a second communication system to be combined, a protection bandwidth of the first communication system and a protection bandwidth of the second communication system; calculating a frequency deviation value according to the three determined numerical values; determining a frequency offset of the first communication system and a frequency offset of the second communication system according to the frequency deviation value; determining combination cut-off frequencies of the first communication system and the second communication system according to the frequency offsets of the first communication system and the second communication system and an adjacent channel point between the first communication system and the second communication system; and using a bandwidth between the combination cut-off frequencies of the two communication systems as the isolation bandwidth between the two communication systems to perform combination.